ZHCSBQ0B July   2013  – March 2015 TPS7A3501

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Filter Operation
      2. 7.3.2 Minimum Load
      3. 7.3.3 Shutdown
      4. 7.3.4 Internal Current Limit
      5. 7.3.5 Reverse Current
      6. 7.3.6 Undervoltage Lockout (UVLO)
      7. 7.3.7 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Adjustable Voltage Drop
        2. 8.2.2.2 Input and Output Capacitor Requirements
        3. 8.2.2.3 Output Noise
        4. 8.2.2.4 Power-Supply Rejection Ratio (PSRR)
        5. 8.2.2.5 Start-up
        6. 8.2.2.6 Transient Response
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
    4. 10.4 Estimating Junction Temperature
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 评估模块
        2. 11.1.1.2 Spice 模型
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

DRV Package
6-Pin WSON
Top View
TPS7A3501 po_bvs228.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
EN 2 I Enable pin. Driving EN high turns on the device (if driven low, EN turns off the device).
EN must not be left floating and can be connected to IN if not used.
GND 3 — Ground
IN 1 I Input supply. A capacitor greater than or equal to 10 µF must be tied from this pin to ground to assure stability. This configuration is especially important when long input traces or high source impedances are encountered. TI recommends using X5R- or X7R-type dielectrics to minimize the temperature variations inherent to capacitors.
NR 4 O Noise-reduction pin. When a capacitor is connected from this pin to GND, RMS noise can be reduced to very low levels. A capacitor greater than or equal to 10 nF must be tied from this pin to ground to assure stability. TI recommends connecting a 1-µF capacitor from NR to GND (as close to the device as possible) to maximize AC performance and minimize noise. TI recommends using X5R- or X7R-type dielectrics to minimize the temperature variations inherent to capacitors. In addition, when a resistor is connected from this pin to GND or IN, the device input-to-output voltage can be programmed; see Feature Description for details.
OUT 6 O Regulator output. A capacitor greater than or equal to 10 µF must be tied from this pin to ground to assure stability. TI recommends using a X5R- or X7R-type dielectrics to minimize the temperature variations inherent to capacitors.
PowerPAD™ — — Connect the PowerPAD to the ground plane for improved thermal performance.
SENSE 5 I Control-loop error amplifier input. This pin must be connected to OUT.
TI recommends connecting SENSE at the point of load to maximize accuracy.
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