ZHCSAM1F December   2012  – December 2017 TPS7A66-Q1 , TPS7A69-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      硬件启用选项
      2.      输入电压感测选项
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Regulated Output (VOUT)
      3. 7.3.3 Power-On Reset (PG)
      4. 7.3.4 Reset Delay Timer (CT)
      5. 7.3.5 Sense Comparator (SI and SO for TPS7A69-Q1)
      6. 7.3.6 Adjustable Output Voltage (FB for TPS7A6601-Q1)
      7. 7.3.7 Undervoltage Shutdown
      8. 7.3.8 Low-Voltage Tracking
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Regulation
      2. 7.4.2 Disabled
      3. 7.4.3 Operation With V(VinUVLO)< VIN < VIN(min)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 TPS7A66-Q1 Typical Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Input Capacitor
          2. 8.2.1.2.2 Output Capacitor
        3. 8.2.1.3 Application Curve
      2. 8.2.2 TPS7A69-Q1 Typical Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Low-Voltage Tracking Threshold
        3. 8.2.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Package Mounting
      2. 10.1.2 Board Layout Recommendations to Improve PSRR and Noise Performance
    2. 10.2 Layout Examples
    3. 10.3 Power Dissipation and Thermal Considerations
  11. 11器件和文档支持
    1. 11.1 相关链接
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.3.9 Thermal Shutdown

These devices incorporate a thermal shutdown (TSD) circuit as a protection from overheating. For continuous normal operation, the junction temperature should not exceed the TSD trip point. If the junction temperature exceeds the TSD trip point, the output turns off. When the junction temperature falls below the TSD trip point, the output turns on again.

Thermal protection disables the output when the junction temperature rises to approximately 170°C, allowing the device to cool. Cooling of the junction temperature to approximately 150°C enables the output circuitry. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage as a result of overheating.

The purpose of the design of the internal protection circuitry of the TPS7A66-Q1, TPS7A69-Q1 is for protection against overload conditions, not as a replacement for proper heat-sinking. Continuously running the TPS7A66-Q1 or TPS7A69-Q1 into thermal shutdown degrades device reliability.
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