ZHCS837F March   2012  – October 2023 TPS7A7300

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configurations
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 User-Configurable Output Voltage
      2. 6.3.2 Traditional Adjustable Configuration
      3. 6.3.3 Undervoltage Lockout (UVLO)
      4. 6.3.4 Soft-Start
      5. 6.3.5 Current Limit
      6. 6.3.6 Enable
      7. 6.3.7 Power-Good
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 ANY-OUT Programmable Output Voltage
        2. 7.2.2.2 Traditional Adjustable Output Voltage
        3. 7.2.2.3 Input Capacitor Requirements
        4. 7.2.2.4 Output Capacitor Requirements
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Thermal Considerations
        2. 7.4.1.2 Power Dissipation
        3. 7.4.1.3 Estimating Junction Temperature
      2. 7.4.2 Layout Example
  9. 8 Device And Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, And Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1) TPS7A7300 UNIT
RGW (VQFN)
20 PINS
RθJA Junction-to-ambient thermal resistance 35.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 33.6 °C/W
RθJB Junction-to-board thermal resistance 15.2 °C/W
ψJT Junction-to-top characterization parameter 0.4 °C/W
ψJB Junction-to-board characterization parameter 15.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
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