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ZHCSEP2A November 2015 – November 2015 TPS7A88

PRODUCTION DATA.

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6 Specifications

6.1 Absolute Maximum Ratings

over operating junction temperature range and all voltages with respect to GND (unless otherwise noted)⁽¹⁾

		MIN	MAX	UNIT
Voltage	INx, PGx, ENx⁽³⁾	–0.3	7.0	V
	INx, PGx, ENx (5% duty cycle, pulse duration = 200 µs)	–0.3	7.5
	OUTx	–0.3	V_INx + 0.3⁽²⁾
	SS_CTRLx	–0.3	V_INx + 0.3⁽²⁾
	NR/SSx, FBx⁽³⁾	–0.3	3.6
Current	OUTx⁽³⁾	Internally limited		A
Current	PGx (sink current into device)⁽³⁾		5	mA
Operating junction temperature, T_J		–55	150	°C
Storage temperature, T_stg		–55	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The absolute maximum rating is V_INx + 0.3 V or 7.0 V, whichever is smaller.

(3) Lowercase x indicates that the specification under consideration applies to both channel 1 and channel 2, one channel at a time.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±2000	V
V_(ESD)	Electrostatic discharge	Charged device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±500	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)

		MIN	MAX	UNIT
V_INx	Input supply voltage range	1.4	6.5	V
V_OUTx	Output voltage range	0.8	5.0	V
I_OUTx	Output current	0	1	A
C_INx	Input capacitor, each input	10		µF
C_OUTx	Output capacitor	10		µF
C_NR/SSx	Noise-reduction capacitor		1	µF
R_PG	Power-good pullup resistance	10	100	kΩ
T_J	Junction temperature range	–40	125	°C

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		TPS7A88	UNIT
		RTJ (WQFN)
		20 PINS
R_θJA	Junction-to-ambient thermal resistance	33	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	26.8	°C/W
R_θJB	Junction-to-board thermal resistance	8.0	°C/W
ψ_JT	Junction-to-top characterization parameter	0.3	°C/W
ψ_JB	Junction-to-board characterization parameter	8.0	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	2.4	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over operating temperature range (T_J = –40°C to +125°C), V_INx = 1.4 V, V_OUTx(TARGET) = 0.8 V, I_OUTx = 50 mA, V_ENx = 1.4 V, C_OUTx = 10 μF, C_NR/SSx = 0 nF, C_FFx = 0 nF, SS_CTRLx = GND, PGx pin pulled up to V_INx with 100 kΩ, and for each channel (unless otherwise noted); typical values are at T_J = 25°C

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
V_INx⁽³⁾	Input supply voltage range		1.4		6.5	V
V_REF	Reference voltage			0.8		V
V_UVLO	Input supply UVLO	V_INx rising		1.31	1.39	V
V_HYS	V_UVLO			290		mV
V_OUTx	Output voltage range		0.8 – 1.0%	5.0 + 1.0%		V
V_OUTx	Output voltage accuracy⁽¹⁾⁽²⁾	0.8 V ≤ V_OUTx ≤ 5 V, 5 mA ≤ I_OUTx ≤ 1 A	–1.0%		1.0%
ΔV_OUTx(ΔVINx)	Line regulation	I_OUTx= 5 mA, 1.4 V ≤ V_INx ≤ 6.5 V		0.003		%/V
ΔV_{OUTx(ΔIOUTx)}	Load regulation	5 mA ≤ I_OUTx ≤ 1 A		0.03		%/A
V_DO	Dropout voltage	V_INx ≥ 1.4 V, 0.8 V ≤ V_OUTx ≤ 5.0 V, I_OUTx = 1 A, V_FBx = 0.8 V – 3%			200	mV
I_LIM	Output current limit	V_OUTx forced at 0.9 × V_OUTx(TARGET), V_INx = V_OUTx(TARGET) + 300 mV	1.5	1.7	1.9	A
I_GND	GND pin current	Both channels enabled, per channel, V_INx = 6.5 V, I_OUTx = 5 mA		2.1	3.5	mA
I_GND	GND pin current	Both channels enabled, per channel, V_INx = 1.4 V, I_OUTx = 1 A			4	mA
I_SDN	Shutdown GND pin current	Both channels shutdown, per channel, PGx = (open), V_INx = 6.5 V, V_ENx = 0.5 V		0.1	15	μA
I_ENx	ENx pin current	V_INx = 6.5 V, 0 V ≤ V_ENx ≤ 6.5 V	–0.2		0.2	μA
V_IL(ENx)	ENx pin low-level input voltage (device disabled)		0		0.4	V
V_IH(ENx)	ENx pin high-level input voltage (device enabled)		1.1		6.5	V
I_{SS_CTRLx}	SS_CTRLx pin current	V_INx = 6.5 V, 0 V ≤ V_{SS_CTRLx} ≤ 6.5 V	–0.2		0.2	μA
V_IT(PGx)	PGx pin threshold	For PGx transitioning low with falling V_OUTx, expressed as a percentage of V_OUTx(TARGET)	82%	88.9%	93%
V_hys(PGx)	PGx pin hysteresis	For PGx transitioning high with rising V_OUTx, expressed as a percentage of V_OUTx(TARGET)		1%
V_OL(PGx)	PGx pin low-level output voltage	V_OUTx < V_IT(PGx), I_PGx = –1 mA (current into device)			0.4	V
I_lkg(PGx)	PGx pin leakage current	V_OUTx > V_IT(PGx), V_PGx = 6.5 V			1	µA
I_NR/SSx	NR/SSx pin charging current	V_NR/SSx = GND, 1.4 V ≤ V_INx ≤ 6.5 V, V_{SS_CTRLx} = GND	4.0	6.2	9.0	µA
I_NR/SSx	NR/SSx pin charging current	V_NR/SSx = GND, 1.4 V ≤ V_INx ≤ 6.5 V, V_{SS_CTRLx} = V_INx	65	100	150	µA
I_FBx	FBx pin leakage current	V_INx = 6.5 V, V_FBx = 0.8 V	–100		100	nA
PSRR	Power-supply ripple rejection	f = 500 kHz, V_INx = 3.8 V, V_OUTx = 3.3 V, I_OUTx = 750 mA, C_NR/SSx = 10 nF, C_FFx = 10 nF		40		dB
V_n	Output noise voltage	BW = 10 Hz to 100 kHz, V_INx = 1.8 V, V_OUTx = 0.8 V, I_OUTx = 1.0 A, C_NR/SSx = 1 µF, C_FFx = 100 nF		3.8		μV_RMS
	Noise spectral density	f = 10 kHz, V_INx = 1.8 V, V_OUTx = 0.8 V, I_OUTx = 1.0 A, C_NR/SSx = 10 nF, C_FFx = 10 nF		11		nV/√Hz
R_diss	Output active discharge resistance	V_ENx = GND		250		Ω
T_sd	Thermal shutdown temperature	Shutdown, temperature increasing		160		°C
T_sd	Thermal shutdown temperature	Reset, temperature decreasing		140		°C

(1) When the device is connected to external feedback resistors at the FBx pin, external resistor tolerances are not included.

(2) The device is not tested under conditions where V_INx > V_OUTx + 2.5 V and I_OUTx = 1 A because the power dissipation is higher than the maximum rating of the package. Also, this accuracy specification does not apply on any application condition that exceeds the power dissipation limit of the package under test.

(3) Lowercase x indicates that the specification under consideration applies to both channel 1 and channel 2, one channel at a time.

6.6 Typical Characteristics

at T_J = 25°C, 1.4 V ≤ V_INx < 6.5 V, V_INx ≥ V_OUTx(TARGET) + 0.3 V, V_OUTx = 0.8 V, SS_CTRLx = GND, I_OUTx = 5 mA, V_ENx = 1.1 V, C_OUTx = 10 μF, C_NR/SSx = 0 nF, C_FFx = 0 nF, PGx pin pulled up to V_OUTx with 100 kΩ, and SS_CTRLx = GND (unless otherwise noted)

V_OUTx = 1.2 V, V_INx = V_ENx = 1.7 V, I_OUTx = 1 A, C_OUTx = 10 µF, C_NR/SSx = C_FFx = 10 nF

Figure 1. Power-Supply Rejection vs Output Current

V_OUTx = 1.2 V, I_OUTx = 1.0 A, C_OUTx = 10 µF,
C_NR/SSx = C_FFx = 10 nF

Figure 3. Power-Supply Rejection vs Input Voltage

V_OUTx = 1.2 V, V_INx = V_ENx = 1.7 V, I_OUTx = 1.0 A,
C_OUTx = ceramic, C_FFx = 10 nF

Figure 5. Power-Supply Rejection vs Output Capacitance

V_OUTx = 1.8 V, I_OUTx = 100 mA, C_OUTx = 10 µF,
C_NR/SSx = C_FFx = 10 nF

Figure 7. Channel-to-Channel Output Voltage Isolation vs Frequency

V_INx = 1.7 V, V_OUTx = 1.2 V, I_OUTx = 1.0 A, V_RMS BW = 10 Hz to 100 kHz, C_OUTx = 10 µF, C_FFx = 10 nF

Figure 9. Spectral Noise Density vs C_NR/SSx

V_OUTx = 1.2 V, I_OUTx = 1.0 A, C_OUTx = 10 µF, C_NR/SSx = 10 nF

Figure 11. Spectral Noise Density vs V_INx

V_OUTx = 1.8 V, I_OUTx = 1.0 A, C_FFx = 0.01 µF,
BW = 10 Hz to 100 kHz

Figure 13. RMS Output Noise vs C_NR/SSx

V_INx = 1.5 V, I_OUTx = 100 mA to 1 A to 100 mA at 1 A/µs,
C_OUTx = 10 µF

Figure 15. Load Transient Response (V_OUTx = 1.2 V)

V_INx = 1.4 V to 6.5 V to 1.4 V at 2 V/µs, V_OUTx = 0.8 V,
I_OUTx = 1 A, C_NR/SSx = C_FFx = 10 nF

Figure 17. Line Transient

V_INx = 1.4 V

Figure 19. Start-Up (SS_CTRLx = GND, C_NR/SSx = 0 nF)

V_INx = 1.4 V

Figure 21. Start-Up (SS_CTRLx = V_INx, C_NR/SSx = 10 nF)

V_INx = 5.5 V

Figure 23. Dropout Voltage vs Output Current

V_INx = 1.4 V

Figure 25. Load Regulation (V_OUTx = 0.8 V)

V_INx = 3.8 V

Figure 27. Load Regulation (V_OUTx = 3.3 V)

V_INx = 5.5 V

Figure 29. Load Regulation (V_OUTx = 5.0 V)

V_INx = 1.4 V, both channels enabled

Figure 31. Ground Current vs Output Current

Figure 33. PG Low Level vs PG Current (V_INx = 1.4 V)

V_INx = 6.5 V

Figure 35. PG Threshold vs Temperature

Figure 37. Soft-Start Current vs Temperature
(SS_CTRLx = GND)

Figure 39. Enable Threshold vs Temperature (V_INx = 1.4 V)

Figure 41. Input UVLO Threshold vs Temperature

V_OUTx = 1.2 V, V_INx = V_ENx = 1.7 V, I_OUTx = 1.0 A, C_OUTx = 10 µF, C_FFx = 10 nF

Figure 2. Power-Supply Rejection vs C_NR/SSx

V_OUTx = 3.3 V, V_INx = V_ENx = 3.8 V, I_OUTx = 1 A, C_OUTx = 10 µF, C_NR/SSx = C_FFx = 10 nF

Figure 4. Power-Supply Rejection vs Output Current

V_OUTx = 3.3 V, I_OUTx = 1.0 A, C_OUTx = 10 µF,
C_NR/SSx = C_FFx = 10 nF

Figure 6. Power-Supply Rejection vs Input Voltage

V_INx = V_OUTx + 1.0 V, I_OUTx = 1.0 A, V_RMS BW = 10 Hz to 100 kHz, C_OUTx = 10 µF, C_NR/SSx = C_FFx = 10 nF

Figure 8. Spectral Noise Density vs Output Voltage

V_INx = 3.8 V, V_OUTx = 3.3 V, I_OUTx = 1.0 A, V_RMS BW = 10 Hz to 100 kHz, C_OUTx = 10 µF, C_NR/SSx = 10 nF

Figure 10. Spectral Noise Density vs C_FFx

V_OUTx = 1.8 V, I_OUTx = 1.0 A, V_RMS BW = 10 Hz to 100 kHz,
C_FFx = 0.01 µF

Figure 12. Spectral Noise Density vs C_OUTx

V_OUTx = 1.8 V, I_OUTx = 1.0 A, C_NR/SSx = 1 µF,
BW = 10 Hz to 100 kHz

Figure 14. RMS Output Noise vs C_FFx

V_INx = 5.5 V, I_OUTx = 100 mA to 1 A to 100 mA at 1 A/µs,
C_OUTx = 10 µF

Figure 16. Load Transient Response (V_OUTx = 5.0 V)

V_INx = 1.8 V, V_OUTx = 1.5 V

Figure 18. Current Limit Foldback

V_INx = 1.4 V

Figure 20. Start-Up (SS_CTRLx = GND, C_NR/SSx = 10 nF)

V_INx = 1.4 V

Figure 22. Start-Up (SS_CTRLx = V_INx, C_NR/SSx = 1 µF)

I_OUTx = 1 A

Figure 24. Dropout Voltage vs Input Voltage

I_OUTx = 50 mA

Figure 26. Line Regulation (V_OUTx = 0.8 V)

I_OUTx = 5 mA

Figure 28. Line Regulation (V_OUTx = 3.3 V)

Both channels

Figure 30. Shutdown Current vs Input Voltage

Both channels enabled

Figure 32. Ground Current vs Input Voltage

Figure 34. PG Low Level vs PG Current (V_INx = 6.5 V)

V_INx = V_PGx = 6.5 V

Figure 36. PG Leakage Current vs Temperature

Figure 38. Soft-Start Current vs Temperature
(SS_CTRLx = V_INx)

Figure 40. Enable Threshold vs Temperature (V_INx = 6.5 V)

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6 Specifications

6.1 Absolute Maximum Ratings

6.2 ESD Ratings

6.3 Recommended Operating Conditions

6.4 Thermal Information

6.5 Electrical Characteristics

6.6 Typical Characteristics