ZHCSOZ7A june   2022  – august 2023 TPS7B4255-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Tracker Output Voltage (VOUT)
        1. 7.3.1.1 Output Voltage Equal to the Reference Voltage
        2. 7.3.1.2 Output Voltage Less Than the Reference Voltage
      2. 7.3.2 Reverse Current Protection
      3. 7.3.3 Undervoltage Lockout
      4. 7.3.4 Thermal Protection
      5. 7.3.5 Current Limit
      6. 7.3.6 Output Short to Battery
      7. 7.3.7 Tracking Regulator With an Enable Circuit
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Operation With VIN < 3 V
      4. 7.4.4 Disable With ADJ/EN Control
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Dropout Voltage
      2. 8.1.2 Reverse Current
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Package Mounting
        2. 8.4.1.2 Board Layout Recommendations to Improve PSRR and Noise Performance
        3. 8.4.1.3 Power Dissipation and Thermal Considerations
        4. 8.4.1.4 Thermal Performance Versus Copper Area
      2. 8.4.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical Data

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) (2) TPS7B4255-Q1 UNIT
DBV (SOT-23) DYB (SOT-23)
5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 176.3 127.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 75.6 59.9 °C/W
RθJB Junction-to-board thermal resistance 44.4 16.6 °C/W
ΨJT Junction-to-top characterization parameter 17.9 4.4 °C/W
ΨJB Junction-to-board characterization parameter 44.1 16.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) The thermal data is based on the JEDEC standard high K profile, JESD 51-7, two-signal, two-plane, four-layer board with 2-oz. copper. The copper pad is soldered to the thermal land pattern. Also, correct attachment procedure must be incorporated
(2) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
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