ZHCSDQ2C January   2015  – September 2018 TPS7B7701-Q1 , TPS7B7702-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     703A I2C
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fault Detection and Protection
      2. 7.3.2  Short-Circuit and Overcurrent Protection
      3. 7.3.3  Short-to-Battery and Reverse Current Detection
      4. 7.3.4  Thermal Shutdown
      5. 7.3.5  Integrated Reverse-Polarity Protection
      6. 7.3.6  Integrated Inductive Clamp
      7. 7.3.7  Undervoltage Lockout
      8. 7.3.8  Enable (EN, EN1, and EN2)
      9. 7.3.9  Internal Voltage Regulator (VCC)
      10. 7.3.10 Current Sense Multiplexing
      11. 7.3.11 Adjustable Output Voltage (FB, FB1, and FB2)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With IN < 4.5 V
      2. 7.4.2 Operation With EN Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Capacitor
        2. 8.2.2.2 Output Capacitor
        3. 8.2.2.3 Current Sense Resistor Selection
        4. 8.2.2.4 Current-Limit Resistor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 相关链接
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TPS7B7701-Q1 TPS7B7702-Q1 UNIT
PWP
(HTSSOP)		 PWP
(HTSSOP)
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance (2) 45.9 40.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 29.2 27.7 °C/W
RθJB Junction-to-board thermal resistance 24.7 22.3 °C/W
ψJT Junction-to-top characterization parameter 1.3 0.8 °C/W
ψJB Junction-to-board characterization parameter 24.5 22 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.7 2.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The thermal data is based on JEDEC standard high K profile – JESD 51-7. The copper pad is soldered to the thermal land pattern. Also correct attachment procedure must be incorporated
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