SLVSH48A May   2024  – September 2024 TPS7H1121-SP

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Quality Conformance Inspections
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Adjustable Output Voltage (Feedback Circuit)
      2. 8.3.2  Enable
      3. 8.3.3  Dropout Voltage VDO
      4. 8.3.4  Output Voltage Accuracy
      5. 8.3.5  Output Noise
      6. 8.3.6  Power Supply Rejection Ratio (PSRR)
      7. 8.3.7  Soft Start
      8. 8.3.8  Power Good (PG)
      9. 8.3.9  Stability
        1. 8.3.9.1 Stability
        2. 8.3.9.2 STAB Pin
      10. 8.3.10 Programmable Current Limit
      11. 8.3.11 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable / Disable
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Voltage Configuration
        2. 9.2.2.2 Output Voltage Accuracy
        3. 9.2.2.3 Enable Threshold
        4. 9.2.2.4 Soft Start Capacitor
        5. 9.2.2.5 Programmable Current Limit Resistor
        6. 9.2.2.6 Characterization of Overcurrent Events that Exceed Thermal Limits
        7. 9.2.2.7 Power Good Pull Up Resistor
        8. 9.2.2.8 Capacitors
          1. 9.2.2.8.1 Hybrid Output Capacitor Network
        9. 9.2.2.9 Frequency Compensation
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • HFT|22
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TPS7H1121-SP TPS7H1121-SP, -SEP UNIT
CFP HFT PWP (HTSSOP)
22 PINS 24 PINS
RθJA Junction-to-ambient thermal resistance 30.5 26.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 13.3 18 °C/W
RθJB Junction-to-board thermal resistance 13.5 7.7 °C/W
ΨJT Junction-to-top characterization parameter 5 0.2 °C/W
ΨJB Junction-to-board characterization parameter 13.3 7.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.1 0.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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