ZHCSRP2B February 2023 – December 2023 TPS7H3302-SEP , TPS7H3302-SP
PRODUCTION DATA
- 1
- 1 特性
- 2 应用
- 3 说明
- 4 Device Options
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Application
- 8.2.1 Design Requirements
- 8.2.2
Detailed Design Procedure
- 8.2.2.1 VDD Capacitor
- 8.2.2.2 VLDO Input Capacitor
- 8.2.2.3 VTT Output Capacitor
- 8.2.2.4 VTTSNS Connection
- 8.2.2.5 Low VDD Applications
- 8.2.2.6 S3 and Pseudo-S5 Support
- 8.2.2.7 Tracking Startup and Shutdown
- 8.2.2.8 Output Tolerance Consideration for VTT DIMM or Module Applications
- 8.2.2.9 LDO Design Guidelines
- 8.2.3 Application Curve
- 8.3 Power Supply Recommendations
- 8.4 Layout
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
- DAP|32
散热焊盘机械数据 (封装 | 引脚)
- DAP|32
订购信息
9.5 静电放电警告
 |
静电放电 (ESD) 会损坏这个集成电路。米6体育平台手机版_好二三四 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序，可能会损坏集成电路。 |
| ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。 |