ZHCSRP2B February   2023  – December 2023 TPS7H3302-SEP , TPS7H3302-SP

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Device Options
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VTT Sink and Source Regulator
      2. 7.3.2 Reference Input (VDDQSNS)
      3. 7.3.3 Reference Output (VTTREF)
      4. 7.3.4 EN Control (EN)
      5. 7.3.5 Power-Good Function (PGOOD)
      6. 7.3.6 VTT Current Protection
      7. 7.3.7 VIN UVLO Protection
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 VDD Capacitor
        2. 8.2.2.2 VLDO Input Capacitor
        3. 8.2.2.3 VTT Output Capacitor
        4. 8.2.2.4 VTTSNS Connection
        5. 8.2.2.5 Low VDD Applications
        6. 8.2.2.6 S3 and Pseudo-S5 Support
        7. 8.2.2.7 Tracking Startup and Shutdown
        8. 8.2.2.8 Output Tolerance Consideration for VTT DIMM or Module Applications
        9. 8.2.2.9 LDO Design Guidelines
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Thermal Considerations
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DAP|32
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision A (May 2023) to Revision B (December 2023)

  • 将 TPS7H3302-SP 状态从“米6体育平台手机版_好二三四预发布”更改为“量产数据”Go
  • Removal of "Product Preview" for TPS7H3302-SPGo
  • Removed typical thermal shutdownGo
  • Updated VTTREF accuracy to a percentage difference from VDDQSNS (DDR4, DDR3L, DDR3, DDR2 and DDR) at ±10 mA and ± 3 mA Go
  • Added correct cross reference for output current limitGo
  • Modified description for Thermal ShutdownGo
  • Changed wording for clarity for VIN/VDD Go
  • Updated part reference from TPS7H3302-SEP to TPS7H3302 in imageGo
  • Change of part reference in image from TPS7H3302-SEP to TPS7H3302Go
  • Correction of graphical error in Layout ExampleGo

Changes from Revision * (February 2023) to Revision A (May 2023)

  • 将 TPS7H3302-SEP 状态从“预告信息”更改为“量产数据”Go
  • 为 QMLP 版本 TPS7H3302-SP 添加了“米6体育平台手机版_好二三四预发布”说明Go
  • 在“特性”部分和“器件选项”表中添加了 TPS7H3302-SP(米6体育平台手机版_好二三四预发布)辐射等级Go
  • Typical characGo