ZHCSO27B May   2021  – December 2022 TPS7H4002-SP

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  VIN and Power VIN Pins (VIN and PVIN)
      2. 7.3.2  Voltage Reference
      3. 7.3.3  Adjusting the Output Voltage
      4. 7.3.4  Safe Start-Up Into Prebiased Outputs
      5. 7.3.5  Error Amplifier
      6. 7.3.6  Slope Compensation
      7. 7.3.7  Enable and Adjust UVLO
      8. 7.3.8  Adjustable Switching Frequency and Synchronization (SYNC)
      9. 7.3.9  Slow Start (SS/TR)
      10. 7.3.10 Power Good (PWRGD)
      11. 7.3.11 Sequencing (SS/TR)
      12. 7.3.12 Output Overvoltage Protection (OVP)
      13. 7.3.13 Overcurrent Protection
        1. 7.3.13.1 High-Side MOSFET Overcurrent Protection
        2. 7.3.13.2 Low-Side MOSFET Overcurrent Protection
      14. 7.3.14 Thermal Shutdown
      15. 7.3.15 Turn-On Behavior
      16. 7.3.16 Small Signal Model for Frequency Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Fixed-Frequency PWM Control
      2. 7.4.2 Continuous Current Mode (CCM) Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Operating Frequency
        2. 8.2.2.2 Output Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Output Schottky Diode
        5. 8.2.2.5 Slow Start Capacitor Selection
        6. 8.2.2.6 Undervoltage Lockout (UVLO) Set Point
        7. 8.2.2.7 Output Voltage Feedback Resistor Selection
        8. 8.2.2.8 Compensation Component Selection
      3. 8.2.3 Parallel Operation
      4. 8.2.4 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

Figure 5-1 HKH Package
20-Pin CFP
Bottom View
Table 5-1 Pin Functions
PIN I/O DESCRIPTION
NO. NAME
1 GND — Return for control circuitry.(1)
2 EN I EN pin is internally pulled up allowing for the pin to be floated to enable the device. Adjust the input undervoltage lockout (UVLO) with two resistors.
3 RT I/O In internal oscillation mode, a resistor is connected between the RT pin and GND to set the switching frequency. Leaving this pin floating sets the internal switching frequency to 500 kHz.
4 SYNC I/O Optional 100-kHz to 1-MHz external system clock input.
5 VIN I Input power for the control circuitry of the switching regulator.
6 PVIN I Input power for the output stage of the switching regulator.
7
8 PGND — Return for low-side power MOSFET.
9
10
11 PH O Switch phase node.
12
13
14
15
16 REFCAP O Required 470-nF external capacitor for internal reference.
17 VSENSE I Inverting input of the gm error amplifier.
18 COMP I/O Error amplifier output and input to the output switch current comparator. Connect frequency compensation to this pin.
19 SS/TR I/O Slow-start and tracking. An external capacitor connected to this pin sets the internal voltage reference rise time. The voltage on this pin overrides the internal reference. It can be used for tracking and sequencing.
20 PWRGD O Power Good fault pin. Asserts low if output voltage is low due to thermal shutdown, dropout, overvoltage, or EN shutdown, or during slow start.
(1) GND (pin 1, analog ground) must be connected to PGND external to the package. Thermal pad must be connected to a heat dissipating layer. Thermal pad is internally connected to the seal ring and GND.
Table 5-2 Bare Die Information
DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS
15 mils Silicon with backgrind Ground ALCU 1050 nm
GUID-E3A43722-D846-4104-857A-783849165725-low.png
Table 5-3 Bond Pad Coordinates in Microns
DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX
AVSS 1 938.16 5098.41 1064.16 5224.41
AVSS 2 759.06 5098.41 885.06 5224.41
N/C 3 579.96 5098.41 705.96 5224.41
AVSS 4 400.86 5098.41 526.86 5224.41
AVSS 5 221.76 5098.41 347.76 5224.41
EN 6 38.7 4843.98 164.7 4969.98
RT 7 38.7 4115.43 164.7 4241.43
SYNC 8 38.7 3936.33 164.7 4062.33
VIN 9 55.89 3473.865 181.89 3599.865
VIN 10 55.89 3285.765 181.89 3411.765
VIN 11 55.89 3097.665 181.89 3223.665
VIN 12 55.89 2909.565 181.89 3035.565
PVIN 13 360.045 2468.025 486.045 2594.025
PVIN 14 500.805 2468.025 626.805 2594.025
PVIN 15 643.905 2468.025 769.905 2594.025
PVIN 16 782.505 2468.025 908.505 2594.025
PVIN 17 360.045 2312.595 486.045 2438.595
PVIN 18 500.805 2312.595 626.805 2438.595
PVIN 19 643.905 2312.595 769.905 2438.595
PVIN 20 782.505 2312.595 908.505 2438.595
PVIN 21 360.045 1868.265 486.045 1994.265
PVIN 22 500.805 1868.265 626.805 1994.265
PVIN 23 643.905 1868.265 769.905 1994.265
PVIN 24 782.505 1868.265 908.505 1994.265
PVIN 25 360.045 1712.835 486.045 1838.835
PVIN 26 500.805 1712.835 626.805 1838.835
PVIN 27 643.905 1712.835 769.905 1838.835
PVIN 28 782.505 1712.835 908.505 1838.835
PGND 29 360 1004.625 486 1130.625
PGND 30 498.6 1004.625 624.6 1130.625
PGND 31 637.2 1004.625 763.2 1130.625
PGND 32 775.8 1004.625 901.8 1130.625
PGND 33 360 863.955 486 989.955
PGND 34 498.6 863.955 624.6 989.955
PGND 35 637.2 863.955 763.2 989.955
PGND 36 775.8 863.955 901.8 989.955
PGND 37 360 384.525 486 510.525
PGND 38 360 243.855 486 369.855
PGND 39 503.1 243.855 629.1 369.855
PGND 40 503.1 384.525 629.1 510.525
PGND 41 641.7 243.855 767.7 369.855
PGND 42 641.7 384.525 767.7 510.525
PGND 43 775.8 243.855 901.8 369.855
PGND 44 775.8 384.525 901.8 510.525
PH 45 1239.66 97.425 1365.66 223.425
PH 46 1374.66 529.965 1500.66 655.965
PH 47 1378.26 97.425 1504.26 223.425
PH 48 1516.86 97.425 1642.86 223.425
PH 49 1657.26 97.425 1783.26 223.425
PH 50 1790.46 529.965 1916.46 655.965
PH 51 1651.86 529.965 1777.86 655.965
PH 52 1513.26 529.965 1639.26 655.965
PH 53 1790.46 718.515 1916.46 844.515
PH 54 1651.86 718.515 1777.86 844.515
PH 55 1513.26 718.515 1639.26 844.515
PH 56 1374.66 718.515 1500.66 844.515
PH 57 1790.46 1150.065 1916.46 1276.065
PH 58 1651.86 1150.065 1777.86 1276.065
PH 59 1513.26 1150.065 1639.26 1276.065
PH 60 1374.66 1150.065 1500.66 1276.065
PH 61 1795.365 1565.1 1921.365 1691.1
PH 62 1655.865 1565.1 1781.865 1691.1
PH 63 1515.465 1565.1 1641.465 1691.1
PH 64 1376.865 1565.1 1502.865 1691.1
PH 65 1795.365 2016 1921.365 2142
PH 66 1655.865 2016 1781.865 2142
PH 67 1515.465 2016 1641.465 2142
PH 68 1376.865 2016 1502.865 2142
PH 69 1795.365 2164.86 1921.365 2290.86
PH 70 1655.865 2164.86 1781.865 2290.86
PH 71 1515.465 2164.86 1641.465 2290.86
PH 72 1376.865 2164.86 1502.865 2290.86
PH 73 1795.365 2615.76 1921.365 2741.76
PH 74 1655.865 2615.76 1781.865 2741.76
PH 75 1515.465 2615.76 1641.465 2741.76
PH 76 1376.865 2615.76 1502.865 2741.76
REFCAP_NU 77 1933.245 3572.46 2059.245 3698.46
VSENSE 78 1933.245 3770.415 2059.245 3896.415
COMP 79 1933.245 3949.515 2059.245 4075.515
SS 80 1933.2 4149.135 2059.2 4275.135
PWRGD 81 1933.2 4292.325 2059.2 4418.325
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