The key to thermal optimization on PCB design is to provide heat transferring paths from the device to the outer large copper area. Use thick copper (2 oz) on high current layer(s) if possible. Use thermal vias under the DAP to transfer heat to other layers. Connect NC pins to the GND net so that GND copper can run underneath the device to create dog-bone shape heat sink. Try to leave copper solid on IC side as much as possible above and below the device. Place components and route traces away from major heat transferring paths, if possible, to avoid blocking heat dissipation path. Try to leave copper solid, free of components and traces, around the thermal vias on the other side of the board as well. Solid copper behaves as heat sink to spread the heat to a larger area.

When calculating power dissipation, use the maximum input voltage and the average output current for the application. Many common operating conditions are provided in Application Curves section. Less common applications can be derived through interpolation. In all designs, the junction temperature must be kept below the rated maximum of 125°C.