It is recommended to place all components as close as possible to the IC. Specially, the input capacitor placement must be closest to the VIN and GND pins of the device.
Use wide and short traces for the main current paths to reduce the parasitic inductance and resistance.
To enhance heat dissipation of the device, the exposed thermal pad should be connected to bottom or internal layer ground planes using vias.
Refer to Figure 30 for an example of component placement, routing and thermal design.
The recommended land pattern for the TPS82084/5 is shown at the end of this data sheet. For best manufacturing results, it is important to create the pads as solder mask defined (SMD). This keeps each pad the same size and avoids solder pulling the device during reflow.