SLVSBR0C October 2014 – June 2015 TPS8268090 , TPS8268105 , TPS8268120 , TPS8268150 , TPS8268180
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
13.1 Package Summary
| SIP PACKAGE |
Code:
- CC — Customer Code (device/voltage specific)
- YML — Y: Year, M: Month, L: Lot trace code
- LSB — L: Lot trace code, S: Site code, B: Board locator
13.2 MicroSiP™ DC/DC Module Package Dimensions
TheTPS8268x is available in an 9-bump ball grid array (BGA) package. The package dimensions are:
- D = 2.30 ±0.05 mm
- E = 2.90 ±0.05 mm