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ZHCSCJ5A June 2014 – June 2014 TPS82740A , TPS82740B

PRODUCTION DATA.

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请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

SIP|9

散热焊盘机械数据 (封装 | 引脚)

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13 Layout

13.1 Layout Guidelines

In making the pad size for the uSiP LGA balls, it is recommended that the layout use a non-solder-mask defined (NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the opening size is defined by the copper pad width. Figure 45 shows the appropriate diameters for a MicroSiP^TM layout. Figure 46 shows a suggestion for the PCB layout.

13.2 Layout Example

Figure 45. Recommended Land Pattern Image and Dimensions

SOLDER PAD DEFINITIONS⁽¹⁾⁽²⁾⁽³⁾⁽⁴⁾	COPPER PAD	SOLDER MASK ⁽⁵⁾ OPENING	COPPER THICKNESS	STENCIL ⁽⁶⁾ OPENING	STENCIL THICKNESS
Non-solder-mask defined (NSMD)	0.30mm	0.360mm	1oz max (0.032mm)	0.34mm diameter	0.1mm thick

(1) Circuit traces from non-solder-mask defined PWB lands should be 75μm to 100μm wide in the exposed area inside the solder mask opening. Wider trace widths reduce device stand off and affect reliability.

(2) Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the intended application.

(3) Recommend solder paste is Type 3 or Type 4.

(4) For a PWB using a Ni/Au surface finish, the gold thickness should be less than 0.5mm to avoid a reduction in thermal fatigue performance.

(5) Solder mask thickness should be less than 20 μm on top of the copper circuit pattern.

(6) For best solder stencil performance use laser cut stencils with electro polishing. Chemically etched stencils give inferior solder paste volume control.

TPS82740A TPS82740B TPS82740_PCB_Layout.gif

Figure 46. PCB Layout Suggestion

13.3 Surface Mount Information

The TPS82740 MicroSIP™ module uses an open frame construction for a fully automated assembly process and provides a large surface area for pick and place operations. See the "Pick Area" in the package drawing.

Package height and weight have been kept to a minimum, allowing MicroSIP™ device handling similar to a 0805 footprint component.

For reflow recommendations, see document J-STD-20 from the JEDEC/IPC standard.