ZHCSL07C September   2019  – August 2021 TPS8802

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  System Power-up
      2. 8.3.2  LDO Regulators
        1. 8.3.2.1 Power LDO Regulator
        2. 8.3.2.2 Internal LDO Regulator
        3. 8.3.2.3 Microcontroller LDO Regulator
      3. 8.3.3  Photo Chamber AFE
        1. 8.3.3.1 Photo Input Amplifier
        2. 8.3.3.2 Photo Gain Amplifier
      4. 8.3.4  LED Driver
        1. 8.3.4.1 LED Current Sink
        2. 8.3.4.2 LED Voltage Supply
      5. 8.3.5  Carbon Monoxide Sensor AFE
        1. 8.3.5.1 CO Transimpedance Amplifier
        2. 8.3.5.2 CO Connectivity Test
      6. 8.3.6  Boost Converter
        1. 8.3.6.1 Boost Hysteretic Control
        2. 8.3.6.2 Boost Soft Start
      7. 8.3.7  Interconnect Driver
      8. 8.3.8  Piezoelectric Horn Driver
        1. 8.3.8.1 Three-Terminal Piezo
        2. 8.3.8.2 Two-Terminal Piezo
      9. 8.3.9  Battery Test
      10. 8.3.10 AMUX
      11. 8.3.11 Analog Bias Block and 8 MHz Oscillator
      12. 8.3.12 Interrupt Signal Alerts
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode
      2. 8.4.2 Fault States
        1. 8.4.2.1 MCU LDO Fault
        2. 8.4.2.2 Over-Temperature Fault
    5. 8.5 Programming
    6. 8.6 Register Maps
      1. 8.6.1  REVID Register (Offset = 0h) [reset = 0h]
      2. 8.6.2  STATUS1 Register (Offset = 1h) [reset = 0h]
      3. 8.6.3  STATUS2 Register (Offset = 2h) [reset = 0h]
      4. 8.6.4  MASK Register (Offset = 3h) [reset = 0h]
      5. 8.6.5  CONFIG1 Register (Offset = 4h) [reset = 20h]
      6. 8.6.6  CONFIG2 Register (Offset = 5h) [reset = 2h]
      7. 8.6.7  ENABLE1 Register (Offset = 6h) [reset = 10h]
      8. 8.6.8  ENABLE2 Register (Offset = 7h) [reset = 0h]
      9. 8.6.9  CONTROL Register (Offset = 8h) [reset = 0h]
      10. 8.6.10 SLPTMR1 Register (Offset = 9h) [reset = 0h]
      11. 8.6.11 SLPTMR2 Register (Offset = Ah) [reset = 0h]
      12. 8.6.12 GPIO_AMUX Register (Offset = Bh) [reset = 0h]
      13. 8.6.13 CO_BATTEST Register (Offset = Ch) [reset = 0h]
      14. 8.6.14 CO Register (Offset = Dh) [reset = 0h]
      15. 8.6.15 VBOOST Register (Offset = Eh) [reset = F2h]
      16. 8.6.16 LEDLDO Register (Offset = Fh) [reset = 0h]
      17. 8.6.17 PH_CTRL Register (Offset = 10h) [reset = 0h]
      18. 8.6.18 LED_DAC_A Register (Offset = 11h) [reset = 0h]
      19. 8.6.19 LED_DAC_B Register (Offset = 12h) [reset = 0h]
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Photo Amplifier Component Selection
        2. 9.2.2.2 LED Driver Component Selection
        3. 9.2.2.3 LED Voltage Supply Selection
        4. 9.2.2.4 Boost Converter Component Selection
        5. 9.2.2.5 Regulator Component Selection
      3. 9.2.3 Application Curves
      4. 9.2.4 3V Battery Smoke and CO Alarm
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Photo Amplifier Layout
      2. 11.1.2 CO Amplifier Layout
      3. 11.1.3 Boost Converter Layout
      4. 11.1.4 Ground Plane Layout
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

STATUS1 Register (Offset = 1h) [reset = 0h]

STATUS1 is shown in Table 8-6.

Return to Summary Table.

Table 8-6 STATUS1 Register Field Descriptions
Bit Field Type Reset Description
7 SLP_DONE RC 0h Sleep timer wakeup flag

0h = device has not transitioned from sleep to active state via timer

1h = device transitioned from sleep to active state via timer

6 VCCLOW RC 0h VCC low warning

0h = no VCCLOW error has occurred

1h = VCC below V_VCCLOW,FALL threshold and VCCLOW_DIS=1 for VCCLOW deglitch time. VCCLOW is masked for 1 ms after VCCLOW_DIS is set to 0.

5 MCULDO_ERR RC 0h MCU LDO power good error

0h = no MCULDO error has occurred

1h = MCU_PG=0 and MCU_EN=1 for TMCULDO,PG. MCULDO_ERR is masked for TMCULDO,MASK after VMCUSET or MCU_DIS has changed

4 OTS_ERR RC 0h Thermal shutdown error

0h = no thermal shutdown error has occurred

1h = junction temperature has exceeded T_SHUTDOWN

3 OTS_WRN RC 0h Thermal warning flag

0h = no thermal warning has occurred

1h = junction temperature has exceeded T_WARNING

2 BST_nACT RC 0h Boost activity monitor

0h = boost converter is actively switching or BST_EN=0 or SLP_EN=1

1h = boost converter has not switched for T_BST,ACT, BST_EN=1 and SLP_EN=0

1 BST_ERR RC 0h Boost converter power good error

0h = no boost converter error has occurred

1h = BST_PG=0 and BST_EN=1 for T_BST,PG. BST_ERR is masked for T_BST,MASK after VBST or BST_EN has changed

0 INT_UNIT RC 0h INT_UNIT pin value

0h = INT_UNIT is below VINT_UNIT,ILO or INT_DIR=1

1h = INT_UNIT is high and INT_DIR=0