8.3.8 Thermal Protection

The TPS92515AHV-Q1 device incorporates thermal protection circuitry. If the TPS92515AHV-Q1 thermal pad is not soldered, or not soldered correctly, the device reaches the thermal shutdown temperature prematurely. Use X-ray inspection or some other means to verify the device thermal pad soldering to ensure correct assembly.

Two internal sensing elements ensure proper temperature measurement across the die. One sensing element is located near the internal FET. The other sensing element is located near the V_CC regulator. Power dissipation the FET and internal regulator contribute the most to device temperature rise.

When the device temperature reaches the thermal shut-down level at the FET sense point, the high-side FET and internal regulator become disabled and switching stops. When thermal shut-down temperature is reached at the regulator sense point, the V_CC regulator becomes disabled, and switching stops when V_CC falls below the VCC_UVLO level. In both cases, after the device lowers 10°C (typical) from the trip temperature, normal operation resumes.