ZHCSMX7A
August 2021 – December 2021
TPS92519-Q1
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Buck Converter Switching Operation
7.3.2
Switching Frequency and Adaptive On-Time Control
7.3.3
Minimum On-Time, Off-Time, and Inductor Ripple
7.3.4
Enable
7.3.5
LED Current Regulation and Error Amplifier
7.3.6
Start-up Sequence
7.3.7
Analog Dimming and Forced Continuous Conduction Mode
7.3.8
External PWM Dimming and Input Undervoltage Lockout (UVLO)
7.3.9
Shunt FET Dimming or Matrix Beam Application
7.3.10
Bias Supply
7.3.11
Bootstrap Supply
7.3.12
Faults and Diagnostics
7.3.13
Output Short Circuit Fault
7.3.14
Output Open Circuit Fault
7.3.15
Parallel Operation
7.4
Device Functional Modes
7.4.1
Power On Reset (POR)
7.4.2
Run Mode
7.4.3
Sleep Mode
8
Application and Implementation
8.1
Application Information
8.1.1
Duty Cycle Consideration
8.1.2
Switching Frequency Selection
8.1.3
LED Current Set Point
8.1.4
Inductor Selection
8.1.5
Output Capacitor Selection
8.1.6
Input Capacitor Selection
8.1.7
Bootstrap Capacitor Selection
8.1.8
Compensation Capacitor Selection
8.1.9
Input Undervoltage Protection
8.1.10
CSN Protection Diode
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Calculating Duty Cycle
8.2.2.2
Calculating Minimum On-Time and Off-Time
8.2.2.3
Minimum Switching Frequency
8.2.2.4
LED Current Set Point
8.2.2.5
Inductor Selection
8.2.2.6
Output Capacitor Selection
8.2.2.7
Bootstrap Capacitor Selection
8.2.2.8
Compensation Capacitor Selection
8.2.2.9
PWM Dimming and Input Voltage Protection
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.1.1
Compact Layout for EMI Reduction
10.1.1.1
Ground Plane
10.2
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
支持资源
11.4
Trademarks
11.5
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DAP|32
MPDS380A
散热焊盘机械数据 (封装 | 引脚)
DAP|32
PPTD363
订购信息
zhcsmx7a_oa
zhcsmx7a_pm
8.2.2
Detailed Design Procedure
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP
|
米乐app下载官网(中国)|ios|Android/通用版APP最新版
|
米乐|米乐·M6(中国大陆)官方网站
|
千亿体育登陆地址
|
华体会体育(中国)HTH·官方网站
|
千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载
|
18新利网v1.2.5|中国官方网站
|
bob电竞真人(中国官网)安卓/ios苹果/电脑版【1.97.95版下载】
|
千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装
|