ZHCSDK4C September   2014  – January 2020 TPS92638-Q1

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 典型应用原理图
  5. 修订历史记录
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 LED Current Setting
      2. 9.3.2 PWM Control
      3. 9.3.3 Fault Diagnostics
        1. 9.3.3.1 Open-Load Detection
      4. 9.3.4 Thermal Foldback
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 PWM Dimming by Bank
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Performance Plots
      2. 10.2.2 Two Brightness Levels for TAIL and STOP Lights
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
      3. 10.2.3 PWM Dimming by Modulated Supply
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Design Procedure
      4. 10.2.4 Driving LEDs From a Single Device With Channels in Parallel
        1. 10.2.4.1 Design Requirements
        2. 10.2.4.2 Design Procedure
      5. 10.2.5 Driving LEDs From Multiple Devices With Channels in Parallel
        1. 10.2.5.1 Design Requirements
        2. 10.2.5.2 Design Procedure
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Information
  13. 13器件和文档支持
    1. 13.1 商标
    2. 13.2 静电放电警告
    3. 13.3 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Information

This device operates a thermal shutdown (TSD) circuit as a protection from overheating. For continuous normal operation, the junction temperature should not exceed the thermal-shutdown trip point. If the junction temperature exceeds the thermal-shutdown trip point, the output turns off. When the junction temperature falls below the thermal-shutdown trip point minus hysteresis, the output turns on again.

Calculate the power dissipated by the device according to the following formula:

Equation 15. TPS92638-Q1 Eq15-Pic_SLVSCK5.gif

where:

nk = Number of LEDs for x channel

V(LEDk)= Voltage drop across one LED for x channel

V(REF) = Reference voltage, typically 1.24 V

I(LEDk) = Average LED current for channel k

After determining the power dissipated by the device, calculate the junction temperature from the ambient temperature and the device thermal impedance.

Equation 16. TPS92638-Q1 Eq14-Tj_SLVSCK5.gif

where:

TA = Ambient temperature

RθJA = Junction-to-ambient thermal impedance

P(IC) = Dissipated power