ZHCSQK6 May 2022 TPS92643-Q1
PRODUCTION DATA
THERMAL METRIC(1) | DEVICE | UNIT | |
---|---|---|---|
PKG (HTSSOP) | |||
PINS | |||
RθJA | Junction-to-ambient thermal resistance | 38.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 24.3 | °C/W |
RθJB | Junction-to-board thermal resistance | 19.9 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.7 | °C/W |
ΨJB | Junction-to-board characterization parameter | 19.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.7 | °C/W |