ZHCSCS9 SEPTEMBER   2014 TPS92661-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Controlling the Internal LED Bypass Switches
      2. 7.3.2  Internal Switch Resistance
      3. 7.3.3  PWM Dimming
      4. 7.3.4  PWM Clock
      5. 7.3.5  PWM Synchronization
      6. 7.3.6  Switch Slew Control
      7. 7.3.7  Effect of Phase Shifting LED Duty Cycles
      8. 7.3.8  LED Fault Detection and Protection
        1. 7.3.8.1 Fault Reporting and Timing
          1. 7.3.8.1.1 LED Open Fault Detect Timing Example
      9. 7.3.9  Glitch-Free Operation
        1. 7.3.9.1 Atomic Multi-Byte Writes
        2. 7.3.9.2 Synchronous Updates
          1. 7.3.9.2.1 LEDxON = LEDxOFF Boundary Condition
      10. 7.3.10 Internal Oscillator and Watchdog Timers
        1. 7.3.10.1 Clock Watchdog Timer
        2. 7.3.10.2 Communications Watchdog Timer
    4. 7.4 Device Functional Modes
      1. 7.4.1  Digital Interface Connections
        1. 7.4.1.1  Address (ADR0, ADR1, and ADR2 Pins)
        2. 7.4.1.2  Clock (CLK Pin)
        3. 7.4.1.3  Internal Charge Pump (CPP Pin)
        4. 7.4.1.4  Enable (EN Pin)
        5. 7.4.1.5  GND Pin
        6. 7.4.1.6  Receive (RX Pin)
        7. 7.4.1.7  Synchronization (SYNC Pin)
        8. 7.4.1.8  Transmit (TX Pin)
        9. 7.4.1.9  Primary Power Supply (VIN Pin)
        10. 7.4.1.10 On-Board 3.3-V Supply (VCC Pin)
      2. 7.4.2  Internal Pin-to-Pin Resistance
      3. 7.4.3  UART Physical Layer
      4. 7.4.4  UART Clock and Baudrate
      5. 7.4.5  UART Communications Reset
      6. 7.4.6  UART Device Addressing
      7. 7.4.7  UART Communications Protocol
        1. 7.4.7.1 Example 1:
        2. 7.4.7.2 Example 2:
        3. 7.4.7.3 Example 3:
      8. 7.4.8  Transaction Frame Description
      9. 7.4.9  Frame Initialization Byte
      10. 7.4.10 Register Address
      11. 7.4.11 Data Bytes
      12. 7.4.12 CRC Bytes
      13. 7.4.13 Registers
        1. 7.4.13.1 LED ON Registers
        2. 7.4.13.2 LED OFF Registers
        3. 7.4.13.3 Alternate LED On/Off Registers
        4. 7.4.13.4 Enable Registers
        5. 7.4.13.5 Control Registers
          1. 7.4.13.5.1 PWM Clock Divider Register (PCKDIV)
          2. 7.4.13.5.2 System Configuration Register (SYSCFG)
        6. 7.4.13.6 Default LED State Register (DEFLED)
        7. 7.4.13.7 PWM Period Counter Register (TCNT)
        8. 7.4.13.8 Diagnostic Registers
    5. 7.5 Programming
      1. 7.5.1 Read / Write Register Flow Chart
        1. 7.5.1.1 Register Write Flow Chart
        2. 7.5.1.2 Register Read Flow Chart
      2. 7.5.2 Complete Transaction Example
      3. 7.5.3 CRC Calculation Programming Examples
      4. 7.5.4 Code Examples to Implement Register Reads/Writes
    6. 7.6 Register Map
  8. 8 Application and Implementation
    1. 8.1 Applications Information
      1. 8.1.1 Guidelines For Current Source
    2. 8.2 Design Examples
      1. 8.2.1 12 LED, 1.2-A Application
      2. 8.2.2 6 LED, 1.5-A Application
  9. 9 Power Supply Recommendations
    1. 9.1 General Recommendations
    2. 9.2 Internal Regulator
    3. 9.3 Power Up and Reset
    4. 9.4 VIN Power Consumption
    5. 9.5 Initialization Set-Up
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 商标
    2. 11.2 静电放电警告
    3. 11.3 Export Control Notice
    4. 11.4 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

PHP (TQFP) PACKAGE
48 PINS
(TOP VIEW)
PinOut_PHP-48_SLUSBU2.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
ADR0 22 I Least significant bit (LSB) of device address. Connect to VIN or GND.
ADR1 15 I Second bit of device address. Connect to VIN or GND.
ADR2 16 I Most significant bit (MSB) of device address. Connect to VIN or GND.
CLK 8 I System clock. This clock is provided externally (by the microcontroller unit or an external oscillator) and is the primary clock for the device.
29
CPP 1 I Charge pump output. Bypass with a ceramic capacitor with a minimum value of 0.1 µF to LED12.
EN 4 I Enable pins. The device is active when EN is high or in reset when EN is low. Connect to microcontroller unit output or tie to VCC or VIN for enable at power-up.
33
GND 3, 5, 7, 9, 11, 24, 26, 28, 30, 32, 34 — Device system ground. All pins MUST be connected for proper operation.
LED0 36 O Connect to cathode of LED1.
LED1 37 O Connect to anode of LED1 and cathode of LED2.
LED2 38 O Connect to anode of LED2 and cathode of LED3.
LED3 39 O Connect to anode of LED3 and cathode of LED4.
LED4 40 O Connect to anode of LED4 and cathode of LED5.
LED5 41 O Connect to anode of LED5 and cathode of LED6.
LED6 42 O Connect to anode of LED6 and cathode of LED7.
LED7 43 O Connect to anode of LED7 and cathode of LED8.
LED8 44 O Connect to anode of LED8 and cathode of LED9.
LED9 45 O Connect to anode of LED9 and cathode of LED10.
LED10 46 O Connect to anode of LED10 and cathode of LED11.
LED11 47 O Connect to anode of LED11 and cathode of LED12.
LED12 48 O Connect to anode of LED12.
NC 2, 17, 18, 19, 20, 21, 35 — No connection.
RX 12 I/O Received data pins. Connect one RX pin of first device to microcontroller unit TX output and use second pin to connect to a RX pin of the second device. All other devices use both pins to route the RX line through each device.
25
SYNC 6 I/O Synchronization pins. Allows synchronization of multiple TPS92661 devices on the same network. May be driven by the microcontroller unit, or one TPS92661 device may be programmed via the serial interface to provide this pulse. Only one device should drive this signal. May be left unconnected if not used.
31
TX 10 I/O Transmitted data pins. Connect one TX pin of first device to microcontroller unit RX input and use second pin to connect to a TX pin of the second device. All other devices use both pins to route the TX line through each device. This pin requires a 100kΩ pull-up resistor.
27
VCC 13 O Output of the on-board 3.3-V LDO. This pin requires a ceramic output capacitor with a value of 0.1 µF or greater. Tie to the VIN pin for 5-V microcontroller unit systems.
VIN 14 I 5-V power supply input for device. Bypass with a ceramic capacitor with a minimum value of 0.1 µF.
23
Thermal Pad - Connect to system GND.
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