10.1 Layout Guidelines

The TPS92830-Q1 device relies on external MOSFETs to dissipate heat for high-current applications. To effectively dissipate heat on MOSFETs and LEDs, TI recommends to use 0.071-mm-thick (2-oz.) copper PCBs or metal-based boards. Make the thermal dissipation area with copper as large as possible. Place thermal vias on the thermal dissipation area to further improve the thermal dissipation capability. The current path starts from IN through the sense-resistors, MOSFETs, and LEDs to GND. Wide traces are helpful to reduce parasitic resistance along the current path as shown in the layout example below.

Place capacitors, especially charge pump capacitors, close to the device to make the current path as short as possible. TI suggests keeping the LED high-current ground path separate from device ground. TI also recommends kelvin-connection to the connector. The following layout example shows the recommended guidelines.