ZHCSIF5G December   2015  – July 2024 TPS99000-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics—Transimpedance Amplifier Parameters
    6. 5.6  Electrical Characteristics—Digital to Analog Converters
    7. 5.7  Electrical Characteristics—Analog to Digital Converter
    8. 5.8  Electrical Characteristics—FET Gate Drivers
    9. 5.9  Electrical Characteristics—Photo Comparator
    10. 5.10 Electrical Characteristics—Voltage Regulators
    11. 5.11 Electrical Characteristics—Temperature and Voltage Monitors
    12. 5.12 Electrical Characteristics—Current Consumption
    13. 5.13 Power-Up Timing Requirements
    14. 5.14 Power-Down Timing Requirements
    15. 5.15 Timing Requirements—Sequencer Clock
    16. 5.16 Timing Requirements—Host and Diagnostic Port SPI Interface
    17. 5.17 Timing Requirements—ADC Interface
    18. 5.18 Switching Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Illumination Control
        1. 6.3.1.1 Illumination System High Dynamic Range Dimming Overview
        2. 6.3.1.2 Illumination Control Loop
        3. 6.3.1.3 Continuous Mode Operation
          1. 6.3.1.3.1 Output Capacitance in Continuous Mode
          2. 6.3.1.3.2 Continuous Mode Driver Distortion and Blanking Current
          3. 6.3.1.3.3 Continuous Mode S_EN2 Dissipative Load Shunt Options
          4. 6.3.1.3.4 Continuous Mode Constant OFF Time
          5. 6.3.1.3.5 Continuous Mode Current Limit
        4. 6.3.1.4 Discontinuous Mode Operation
          1. 6.3.1.4.1 Discontinuous Mode Pulse Width Limit
          2. 6.3.1.4.2 COMPOUT_LOW Timer in Discontinuous Operation
          3. 6.3.1.4.3 Dimming Within Discontinuous Operation Range
          4. 6.3.1.4.4 Multiple Pulse Heights to Increase Bit Depth
          5. 6.3.1.4.5 TIA Gain Adjustment
          6. 6.3.1.4.6 Current Limit in Discontinuous Mode
          7. 6.3.1.4.7 CMODE Big Cap Mode in Discontinuous Operation
      2. 6.3.2 Over-Brightness Detection
        1. 6.3.2.1 Photo Feedback Monitor BIST
        2. 6.3.2.2 Excessive Brightness BIST
      3. 6.3.3 Analog to Digital Converter
        1. 6.3.3.1 Analog to Digital Converter Input Table
      4. 6.3.4 Power Sequencing and Monitoring
        1. 6.3.4.1 Power Monitoring
      5. 6.3.5 DMD Mirror Voltage Regulator
      6. 6.3.6 Low Dropout Regulators
      7. 6.3.7 System Monitoring Features
        1. 6.3.7.1 Windowed Watchdog Circuits
        2. 6.3.7.2 Die Temperature Monitors
        3. 6.3.7.3 External Clock Ratio Monitor
      8. 6.3.8 Communication Ports
        1. 6.3.8.1 Serial Peripheral Interface (SPI)
    4. 6.4 Device Functional Modes
      1. 6.4.1 OFF
      2. 6.4.2 STANDBY
      3. 6.4.3 POWERING_DMD
      4. 6.4.4 DISPLAY_RDY
      5. 6.4.5 DISPLAY_ON
      6. 6.4.6 PARKING
      7. 6.4.7 SHUTDOWN
    5. 6.5 Register Maps
      1. 6.5.1 System Status Registers
      2. 6.5.2 ADC Control
      3. 6.5.3 General Fault Status
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 HUD
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Application Design Considerations
          1. 7.2.1.2.1 Photodiode Considerations
          2. 7.2.1.2.2 LED Current Measurement
          3. 7.2.1.2.3 Setting the Current Limit
          4. 7.2.1.2.4 Input Voltage Variation Impact
          5. 7.2.1.2.5 Discontinuous Mode Photo Feedback Considerations
          6. 7.2.1.2.6 Transimpedance Amplifiers (TIAs, Usage, Offset, Dark Current, Ranges, RGB Trim)
      2. 7.2.2 Headlight
        1. 7.2.2.1 Design Requirements
  9. 8 Power Supply Recommendations
    1. 8.1 TPS99000-Q1 Power Supply Architecture
    2. 8.2 TPS99000-Q1 Power Outputs
    3. 8.3 Power Supply Architecture
  10. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Power/High Current Signals
      2. 9.1.2 Sensitive Analog Signals
      3. 9.1.3 High-Speed Digital Signals
      4. 9.1.4 High Power Current Loops
      5. 9.1.5 Kelvin Sensing Connections
      6. 9.1.6 Ground Separation
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1)(2)TPS99000-Q1UNIT
PZP (HTQFP)
100 PINS
RθJC(top)Junction-to-case (top) thermal resistance6.9°C/W
RθJBJunction-to-board thermal resistance8.3°C/W
ψJTJunction-to-top characterization parameter0.1°C/W
ψJBJunction-to-board characterization parameter8.2°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance0.4°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).
(2) Operating ambient temperature is dependent on system thermal design. Operating junction temperature may not exceed its specified range across ambient temperature conditions.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |