ZHCSN32B June   2019  – July 2024 TPS99001-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics—Analog to Digital Converter
    6. 5.6  Electrical Characteristics—Voltage Regulators
    7. 5.7  Electrical Characteristics—Temperature and Voltage Monitors
    8. 5.8  Electrical Characteristics—Current Consumption
    9. 5.9  Power-Up Timing Requirements
    10. 5.10 Power-Down Timing Requirements
    11. 5.11 Timing Requirements—Sequencer Clock
    12. 5.12 Timing Requirements—Host and Diagnostic Port SPI Interface
    13. 5.13 Timing Requirements—ADC Interface
    14. 5.14 Switching Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog to Digital Converter
        1. 6.3.1.1 Analog to Digital Converter Input Table
      2. 6.3.2 Power Sequencing and Monitoring
        1. 6.3.2.1 Power Monitoring
      3. 6.3.3 DMD Mirror Voltage Regulator
      4. 6.3.4 Low Dropout Regulators
      5. 6.3.5 System Monitoring Features
        1. 6.3.5.1 Windowed Watchdog Circuits
        2. 6.3.5.2 Die Temperature Monitors
        3. 6.3.5.3 External Clock Ratio Monitor
      6. 6.3.6 Communication Ports
        1. 6.3.6.1 Serial Peripheral Interface (SPI)
    4. 6.4 Device Functional Modes
      1. 6.4.1 OFF
      2. 6.4.2 STANDBY
      3. 6.4.3 POWERING_DMD
      4. 6.4.4 DISPLAY_RDY
      5. 6.4.5 PARKING
      6. 6.4.6 SHUTDOWN
    5. 6.5 Register Maps
      1. 6.5.1 System Status Registers
      2. 6.5.2 ADC Control
      3. 6.5.3 General Fault Status
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Headlight
        1. 7.2.1.1 Design Requirements
  9. 8 Power Supply Recommendations
    1. 8.1 TPS99001-Q1 Power Supply Architecture
    2. 8.2 TPS99001-Q1 Power Outputs
    3. 8.3 Power Supply Architecture
  10. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Power/High Current Signals
      2. 9.1.2 Sensitive Analog Signals
      3. 9.1.3 High-Speed Digital Signals
      4. 9.1.4 Kelvin Sensing Connections
      5. 9.1.5 Ground Separation
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

5.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman-body model (HBM), per AEC Q100-002(1)±2000V
Charged-device model (CDM), per AEC Q100-011All pins±500
Corner pins±750
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
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