ZHCSN32B June   2019  – July 2024 TPS99001-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics—Analog to Digital Converter
    6. 5.6  Electrical Characteristics—Voltage Regulators
    7. 5.7  Electrical Characteristics—Temperature and Voltage Monitors
    8. 5.8  Electrical Characteristics—Current Consumption
    9. 5.9  Power-Up Timing Requirements
    10. 5.10 Power-Down Timing Requirements
    11. 5.11 Timing Requirements—Sequencer Clock
    12. 5.12 Timing Requirements—Host and Diagnostic Port SPI Interface
    13. 5.13 Timing Requirements—ADC Interface
    14. 5.14 Switching Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog to Digital Converter
        1. 6.3.1.1 Analog to Digital Converter Input Table
      2. 6.3.2 Power Sequencing and Monitoring
        1. 6.3.2.1 Power Monitoring
      3. 6.3.3 DMD Mirror Voltage Regulator
      4. 6.3.4 Low Dropout Regulators
      5. 6.3.5 System Monitoring Features
        1. 6.3.5.1 Windowed Watchdog Circuits
        2. 6.3.5.2 Die Temperature Monitors
        3. 6.3.5.3 External Clock Ratio Monitor
      6. 6.3.6 Communication Ports
        1. 6.3.6.1 Serial Peripheral Interface (SPI)
    4. 6.4 Device Functional Modes
      1. 6.4.1 OFF
      2. 6.4.2 STANDBY
      3. 6.4.3 POWERING_DMD
      4. 6.4.4 DISPLAY_RDY
      5. 6.4.5 PARKING
      6. 6.4.6 SHUTDOWN
    5. 6.5 Register Maps
      1. 6.5.1 System Status Registers
      2. 6.5.2 ADC Control
      3. 6.5.3 General Fault Status
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Headlight
        1. 7.2.1.1 Design Requirements
  9. 8 Power Supply Recommendations
    1. 8.1 TPS99001-Q1 Power Supply Architecture
    2. 8.2 TPS99001-Q1 Power Outputs
    3. 8.3 Power Supply Architecture
  10. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Power/High Current Signals
      2. 9.1.2 Sensitive Analog Signals
      3. 9.1.3 High-Speed Digital Signals
      4. 9.1.4 Kelvin Sensing Connections
      5. 9.1.5 Ground Separation
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1)(2)TPS99001-Q1UNIT
PZP (HTQFP)
100 PINS
RθJC(top)Junction-to-case (top) thermal resistance6.9°C/W
RθJBJunction-to-board thermal resistance8.3°C/W
ψJTJunction-to-top characterization parameter0.1°C/W
ψJBJunction-to-board characterization parameter8.2°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance0.4°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).
(2) Operating ambient temperature is dependent on system thermal design. Operating junction temperature may not exceed its specified range across ambient temperature conditions.
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