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ZHCSN72 june 2023 TPSI2072-Q1

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC ⁽¹⁾		DEVICE	UNIT
		DWQ (SOIC)
		11 PINS
R_ϴJA	Junction-to-ambient thermal resistance	70	°C/W
R_{ϴJA, EVM, 60S}	Junction-to-ambient thermal resistance⁽²⁾⁽³⁾	52	°C/W
R_{ϴJA, EVM, 5S}	Junction-to-ambient thermal resistance⁽²⁾⁽⁴⁾	30	°C/W
R_ϴJB	Junction-to-board thermal resistance	22	°C/W
R_ϴJC(top)	Junction-to-case (top) thermal resistance	26	°C/W
ψ_JT	Junction-to-top characterization parameter	14	°C/W
Ψ_JB	Junction-to-board characterization parameter	21	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

(2) EVM PCB dimensions are 70mm x 70mm x 1.58mm. 4 layer PCB with 2oz Cu on layers 1,4 and 1oz Cu on layer 2,3.

(3) Performance of EVM with power applied for 60s.

(4) Performance of EVM with power applied for 5s.