In three-wire mode, to help ensure a reliable supply voltage, TI recommends that the C_VDDP capacitance from VDDP to VSSP consists of a 0.1-μF bypass capacitor for high frequency decoupling in parallel with a 1 μF for low frequency decoupling.

In two-wire mode, TI recommends that the C_VDDP capacitance placed from VDDP to VSSP consists of a 220-nF capacitor connected close to the device between the VDDP and VSSP pins. The recommended absolute capacitance must be 220 nF, so if derating is required, a higher component value can be needed.

Low-ESR and low-ESL capacitors must be connected close to the device between the VDDP and VSSP pins.