4 Pin Configuration and Functions

Figure 4-1 TPSI31P1-Q1 DVX Package, 16-Pin SSOP(Top View)

PIN		I/O	TYPE⁽¹⁾	DESCRIPTION
NO.	NAME	I/O	TYPE⁽¹⁾	DESCRIPTION
1	EN	I	—	Active high pre-charge enable. Internal 500kΩ pull-down to VSSP.
2	CE	I	—	Active high chip enable. When asserted low, device is disabled. Tie to VDDP or EN when not used. Internal 500kΩ pull-down to VSSP.
4	VDDP	—	P	Power supply for the primary side.
5	PGOOD	O	—	Power good indicator. Open-drain output. When being used, requires external pull-up to VDDP. Float or tie to VSSP when not used.
11, 12	IS+	I	—	Resistor shunt positive. When voltage across shunt resistor exceeds internal reference voltage (1.23V), VDRV is asserted low and remains low until voltage across shunt resistor falls below internal reference (160mV). Internal 3MΩ pull-down to VSSS.
13	VDDM	—	P	Generated mid-supply, nominal 5V.
15	VDDH	—	P	Generated high supply, nominal 17V.
16	VDRV	O	—	Active high driver output.
6,7	NC	NC	—	No connect. Leave floating or connect to VSSP.
3, 8	VSSP	—	GND	Ground supply for the primary side. All VSSP pins must be connected to the primary side ground.
9, 10, 14	VSSS	—	GND	Ground supply for the secondary side. All VSSS pins must be connected to the secondary side ground.

(1) P = power, GND = ground, NC = no connect