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ZHCSLW0A September 2020 – December 2020 TPSM41625

PRODUCTION DATA

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机械数据 (封装 | 引脚)

MOV|69
- MPQF595

散热焊盘机械数据 (封装 | 引脚)

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6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted) ⁽¹⁾

			MIN	MAX	UNIT
Input voltage	PVIN		–0.3	17	V
	PVIN to SW	DC	–0.3	25	V
	PVIN to SW	<10 ns	–5	25	V
	VIN		–0.3	18	V
	VSEL, SS, MODE, RT, SYNC, EN, ISHARE, ILIM		–0.3	7	V
	RS+		–0.3	3.6	V
	RS-		–0.3	0.3	V
	AGND, PGND		–0.3	0.3	V
	SW	DC	–0.3	20	V
	SW	<10 ns	–5.0	20	V
Output voltage	VOUT		–0.3	8	V
	BP5, PGOOD, RAMP		–0.3	7	V
	VSHARE		–0.3	3.6	V
Mechanical shock	Mil-STD-883H, Method 2002.5, 1 msec, 1/2 sine, mounted			500	G
Mechanical vibration	Mil-STD-883H, Method 2007.3, 20 to 2000 Hz			20	G
Operating IC junction temperature, T_J ⁽²⁾			–40	125	°C
Operating ambient temperature, T_A ⁽²⁾			–40	105	°C
Storage temperature, T_stg			–40	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating area (SOA) curves in the typical characteristics sections, ensures that the maximum junction temperature of any component inside the module is never exceeded.