ZHCSLW0A September   2020  – December 2020 TPSM41625

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics (PVIN = 12 V)
    7. 6.7 Typical Characteristics (PVIN = 5 V)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Setting the Output Voltage
      2. 7.3.2  Output Voltage Current Rating
      3. 7.3.3  RS+/RS- Remote Sense Function
      4. 7.3.4  Ramp Select (RAMP and RAMP_SEL)
      5. 7.3.5  Switching Frequency (RT)
      6. 7.3.6  Synchronization (SYNC)
        1. 7.3.6.1 Loss of Synchronization
      7. 7.3.7  Stand-alone/Stackable Operation
        1. 7.3.7.1 Stackable Synchronization
          1. 7.3.7.1.1 Sync Configuration
          2. 7.3.7.1.2 Clock Sync Point Selection
          3. 7.3.7.1.3 Configuration 1: Dual Phase, Primary Sync-Out Clock to Secondary
          4. 7.3.7.1.4 Configuration 2: Dual Phase, Primary and Secondary Sync to External System Clock
      8. 7.3.8  Improved Transient Performance versus Fixed Frequency (Stand-alone Operation Only)
      9. 7.3.9  Output On/Off Enable (EN)
      10. 7.3.10 Power Good (PGOOD)
      11. 7.3.11 Soft-Start Operation
      12. 7.3.12 Input Capacitor Selection
      13. 7.3.13 Output Capacitor Selection
      14. 7.3.14 Current Limit (ILIM)
      15. 7.3.15 Safe Start-up into Pre-Biased Outputs
      16. 7.3.16 Overcurrent Protection
      17. 7.3.17 Output Overvoltage and Undervoltage Protection
      18. 7.3.18 Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Setpoint
        3. 8.2.2.3 Setting the Switching Frequency
        4. 8.2.2.4 RAMP Setting
        5. 8.2.2.5 Input Capacitors
        6. 8.2.2.6 Output Capacitors
      3. 8.2.3 Application Waveforms
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
      1. 10.2.1 Package Specifications
      2. 10.2.2 EMI
        1. 10.2.2.1 EMI Plots
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) 500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) 1000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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