Over the operating ambient temperature range(1)
| PARAMETER |
MIN |
MAX |
UNIT |
| Input voltage |
VIN to PGND |
–0.3 |
66 |
V |
| EN to AGND(2)
|
–0.3 |
VIN + 0.3 |
| PGOOD to AGND(2)
|
–0.3 |
22 |
| FB to AGND |
–0.3 |
5.5 |
| AGND to PGND |
–0.3 |
0.3 |
| Output voltage |
VOUT to
PGND(2)
|
–0.3 |
30 |
| VCC to AGND |
0 |
5.5 |
| Operating IC junction temperature, TJ
(3)
|
|
–40 |
125 |
°C |
| Storage temperature, Tstg
|
–55 |
150 |
°C |
| Peak reflow case temperature |
|
245 |
°C |
| Maximum number or reflows allowed |
|
3 |
|
| Mechanical vibration |
Mil-STD-883H, Method 2007.3, 1 msec, 1/2 sine, mounted |
|
20 |
G |
| Mechanical shock |
Mil-STD-883H, Method 2002.5, 20 to 2000Hz |
|
500 |
G |
(1) Operation outside the Absolute Maximum Ratings may cause
permanent device damage. Absolute Maximum Ratings do not imply functional
operation of the device at these or any other conditions beyond those listed under
Recommended Operating Conditions. If used outside the Recommended Operating
Conditions but within the Absolute Maximum Ratings, the device may not be
fully functional, and this may affect device reliability, functionality, performance,
and shorten the device lifetime.
(2) The voltage on this pin must not exceed the voltage on the VIN pin by
more than 0.3 V.
(3) The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating area (SOA) curves in the typical characteristics sections, ensures that the maximum junction temperature of any component inside the module is never exceeded.