Over the operating ambient temperature range(1)
| PARAMETER |
MIN |
MAX |
UNIT |
| Input voltage |
VIN to PGND |
–0.3 |
66 |
V |
| EN to AGND(2)
|
–0.3 |
VIN + 0.3 |
| PGOOD to AGND(2)
|
–0.3 |
22 |
| FB to AGND |
–0.3 |
5.5 |
| AGND to PGND |
–0.3 |
0.3 |
| Output voltage |
VOUT to PGND(2)
|
–0.3 |
30 |
V |
| VCC to AGND |
0 |
5.5 |
| Operating IC junction temperature, TJ
(3)
|
Non-EXT suffix device |
–40 |
125 |
°C |
| EXT suffix device |
–55 |
125 |
°C |
| Storage temperature, Tstg
|
–55 |
150 |
°C |
| Peak reflow case temperature |
|
245 |
°C |
| Maximum number or reflows allowed |
|
3 |
|
| Mechanical vibration |
Mil-STD-883H, Method 2007.3, 1 msec, 1/2 sine, mounted |
|
20 |
G |
| Mechanical shock |
Mil-STD-883H, Method 2002.5, 20 to 2000Hz |
|
500 |
G |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any conditions beyond those indicated in Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The voltage on this pin must not exceed the voltage on the VIN pin by more than 0.3 V
(3) The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating area (SOA) curves in the typical characteristics sections, ensures that the maximum junction temperature of any component inside the module is never exceeded.