ZHCSMU2B December   2020  – October 2021 TPSM5601R5H , TPSM5601R5HE

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics (VIN = 12 V)
    7. 7.7 Typical Characteristics (VIN = 24 V)
    8. 7.8 Typical Characteristics (VIN = 48 V)
    9. 7.9 Typical Characteristics (VIN = 60 V)
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Adjustable Output Voltage (FB)
      2. 8.3.2 Minimum Input Capacitance
      3. 8.3.3 Minimum Output Capacitance
      4. 8.3.4 Precision Enable (EN), Undervoltage Lockout (UVLO), and Hysteresis (HYS)
      5. 8.3.5 Power Good (PGOOD)
      6. 8.3.6 Spread Spectrum Operation
      7. 8.3.7 Overcurrent Protection (OCP)
      8. 8.3.8 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Active Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Shutdown Mode
  9. Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Output Voltage Setpoint
        3. 9.2.2.3 Input Capacitors
        4. 9.2.2.4 Output Capacitor Selection
        5. 9.2.2.5 Power Good Signal
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Theta JA versus PCB Area
      2. 11.2.2 Package Specifications
      3. 11.2.3 EMI
        1. 11.2.3.1 EMI Plots
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design With WEBENCH® Tools
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

说明

TPSM5601R5Hx 电源模块是一款高度集成的 1.5A 电源解决方案,在热增强型 QFN 封装内整合了一个带有功率 MOSFET 的 60V 输入降压直流/直流转换器、一个屏蔽式电感器和多个无源器件。此 5mm × 5.5mm × 4mm、15 引脚 QFN 封装采用增强型 HotRod QFN 技术来实现增强的热性能、小尺寸和低 EMI。该封装体的所有引脚均分布在外围,具有单个大型散热焊盘,可在制造过程中实现简单布局和轻松处理。

TPSM5601R5Hx 是一款紧凑、易用的电源模块,具有 1.0V 至 16V 的可调节宽输出电压范围。总体解决方案仅需四个外部组件,并且省去了设计流程中的环路补偿和磁性元件选择。全套功能集包括电源正常状态指示、可编程 UVLO、预偏置启动、过流和过热保护,因此 TPSM5601R5Hx 成为为各种应用供电的出色器件。空间受限型应用可从 5mm × 5.5mm 封装中受益。此外,TPSM5601R5HEXT 可在 –55°C 的更低温度下运行,TPSM5601R5HS 支持扩频运行。

器件信息
器件型号 封装(1) 封装尺寸(标称值)
TPSM5601R5H QFN (15) 5.0mm × 5.5mm
TPSM5601R5HE
TPSM5601R5HS
如需了解所有可用封装,请参阅数据表末尾的可订购米6体育平台手机版_好二三四附录。
半桥配置
GUID-20201116-CA0I-CDX3-P2CR-16F4KXPN7JRP-low.gif典型效率 (VOUT = 12V)