ZHCSHU5A July   2017  – March 2018 TPSM82480

PRODUCTION DATA.  

  1. 1 选项
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用电路原理图 空白
      2.      效率与输出电流间的关系空白空白
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Enable / Shutdown (EN)
      2. 7.3.2  Soft Start (SS), Pre-biased Output
      3. 7.3.3  Tracking (TR)
      4. 7.3.4  Output Voltage Select (VSEL)
      5. 7.3.5  Forced PWM (MODE)
      6. 7.3.6  Power Good (PG)
      7. 7.3.7  Thermal Good (TG)
      8. 7.3.8  Active Output Discharge
      9. 7.3.9  Undervoltage Lockout (UVLO)
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pulse Width Modulation (PWM) Operation
      2. 7.4.2 Power Save Mode (PSM) Operation
      3. 7.4.3 Minimum Duty Cycle and 100% Mode Operation
      4. 7.4.4 Phase Shifted Operation
      5. 7.4.5 Phase Add/Shed and Current Balancing
      6. 7.4.6 Current Limit and Short Circuit Protection
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Adjustable Output Voltage
        2. 8.2.2.2 Setting VOUT2 Using the VSEL Feature
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Soft Start Capacitor Selection
        6. 8.2.2.6 Tracking
        7. 8.2.2.7 Thermal Good
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TPSM82480 UNIT
MOP 24 PINS
JEDEC with thermal vias
RθJA Junction-to-ambient thermal resistance 32.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 13.6 °C/W
RθJB Junction-to-board thermal resistance 11.5 °C/W
ψJT Junction-to-top characterization parameter 0.53 °C/W
ψJB Junction-to-board characterization parameter 11.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance - °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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