ZHCSPA2B July 2023 – June 2024 TPSM828301 , TPSM828302 , TPSM828303
PRODMIX
TA = 25°C,VIN = 5V,VOUT = 1.8V,BOM = 表 8-2(除非另有说明)。
VIN = 5V | RDS 封装 | TA = 25°C |
VIN = 3.3V | RDS 封装 | TA = 25°C |
VIN = 2.25V | RDS 封装 | TA = 25°C |
VIN = 5V | RDS 封装 | TA = 85°C |
VIN = 3.3V | RDS 封装 | TA = 85°C |
VIN = 2.25V | RDS 封装 | TA = 85°C |
VOUT = 0.5V | PFM |
VOUT = 0.9V | PFM |
VOUT = 1.2V | PFM |
VOUT = 1.8V | PFM |
VOUT = 2.5V | PFM |
VOUT = 3.3V | PFM |
VOUT = 0.5V | PFM |
VOUT = 1.8V | PFM |
VOUT = 3.3V | PFM |
VIN = 5.0V | TJmax = 125°C | θJA = 49.8°C/W |
IOUT = 100mA | PFM |
IOUT = 1mA 至 2A | PFM | 压摆率 = 1A/μs |
VIN = 4.5V 至 5.5V | PFM | IOUT = 100mA |
VIN = 3.0V 至 3.6V | PFM | IOUT = 100mA |
VOUT = 1.8V |
IOUT = 2A | PFM 或 PWM |
IOUT = 0mA | PFM |
IOUT = 1.0A | PFM 或 PWM |
VIN = 5V | VCB 封装 | TA = 25°C |
VIN = 3.3V | VCB 封装 | TA = 25°C |
VIN = 2.25V | VCB 封装 | TA = 25°C |
VIN = 5V | VCB 封装 | TA = 85°C |
VIN = 3.3V | VCB 封装 | TA = 85°C |
VIN = 2.25V | VCB 封装 | TA = 85°C |
VOUT = 0.5V | PWM |
VOUT = 0.9V | PWM |
VOUT = 1.2V | PWM |
VOUT = 1.8V | PWM |
VOUT = 2.5V | PWM |
VOUT = 3.3V | PWM |
VOUT = 0.5V | PWM |
VOUT = 1.8V | PWM |
VOUT = 3.3V | PWM |
VIN = 3.3V | TJmax = 125°C | θJA = 49.8°C/W |
IOUT = 2A | PWM |
IOUT = 0mA 至 1A | PWM | 压摆率 = 1A/μs |
VIN = 4.5V 至 5.5V | PFM 或 PWM | IOUT = 2A |
VIN = 3.0V 至 3.6V | PFM 或 PWM | IOUT = 2A |
VOUT = 1.8V |
IOUT = 0mA | PFM |
IOUT = 1A | PFM 或 PWM |
IOUT = 1.0A | PFM 或 PWM |