The TPSM8286xA power module temperature must be kept less than the maximum rating of 125°C. The following are three basic approaches for enhancing thermal performance:

• Improve the power dissipation capability of the PCB design.
• Improve the thermal coupling of the component to the PCB.
• Introduce airflow into the system.

To estimate the approximate module temperature of the TPSM8286xA, apply the typical efficiency stated in this data sheet to the desired application condition to compute the power dissipation of the module. Then, calculate the module temperature rise by multiplying the power dissipation by the thermal resistance. Using this method to compute the maximum device temperature, the Safe Operating Area (SOA) graphs demonstrate the required derating in maximum output current at high ambient temperatures. For more details on how to use the thermal parameters in real applications, see the Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs Application Report and Semiconductor and IC Package Thermal Metrics Application Report.