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ZHCSMK6D September 2021 – November 2024 TPSM82864A , TPSM82866A

PRODMIX

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		TPSM8286xA						UNIT
		RDM (23 PINS)		RDJ (23 PINS)		RCF (15 PINS)
		JEDEC 51-5	EVM	JEDEC 51-5	EVM	JEDEC 51-7	EVM
R_θJA	Junction-to-ambient thermal resistance	43.2	25.9	43.3	25.4	66.4	29.9	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	42.5	n/a⁽²⁾	34.3	n/a⁽²⁾	31.8	n/a⁽²⁾	°C/W
R_θJC(bottom)	Junction-to-case (bottom) thermal resistance	21.1	n/a⁽²⁾	22.2	n/a⁽²⁾	n/a⁽³⁾	n/a⁽²⁾	°C/W
R_θJB	Junction-to-board thermal resistance	14.9	n/a⁽²⁾	10.8	n/a⁽²⁾	19.5	n/a⁽²⁾	°C/W
Ψ_JT	Junction-to-top characterization parameter	6.8	3.7	3.6	2.4	(-2.2)⁽⁴⁾	(-4.2)⁽⁴⁾	°C/W
Ψ_JB	Junction-to-board characterization parameter	14.8	12.7	10.7	10.9	18.8	15.5	°C/W

(1) For more information about thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.

(2) Not applicable to an EVM.

(3) Only applicable for packages with exposed thermal pad.

(4) The junction temperature is lower than the inductor temperature leading to a temperature increase towards the top of the package