ZHCSIO9A
August 2018 – June 2021
TPSM831D31
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
References: DAC
6.7
Telemetry
6.8
Current Sense and Calibration
6.9
Logic Interface Pins: A_EN, A_PGOOD, B_EN, B_PGOOD,RESET
6.10
Protections: OVP and UVP
6.11
Typical Characteristics (VIN = 12 V)
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
DCAP+ Control
7.3.2
Setting the Load-Line (DROOP)
7.3.3
Start-Up Timing
7.3.4
Load Transitions
7.3.5
Switching Frequency
7.3.6
RESET Function
7.3.7
VID Table
7.4
Device Functional Modes
7.4.1
Continuous Conduction Mode
7.4.2
Operation With EN Signal Control
7.4.3
Operation With OPERATION Control
7.4.4
Operation With EN and OPERATION Control
7.5
Programming
7.5.1
PMBus Connections
7.5.2
PMBus Address Selection
7.5.3
Supported Commands
7.5.4
Commonly Used PMBus Commands
7.5.5
Voltage, Current, Power, and Temperature Readings
7.5.5.1
(88h) READ_VIN
7.5.5.2
(89h) READ_IIN
7.5.5.3
(8Bh) READ_VOUT
7.5.5.4
(8Ch) READ_IOUT
7.5.5.5
(8Dh) READ_TEMPERATURE_1
7.5.5.6
(96h) READ_POUT
7.5.5.7
(97h) READ_PIN
7.5.5.8
(D4h) MFR_SPECIFIC_04
7.5.6
Output Current Sense and Calibration
7.5.6.1
Reading Individual Phase Currents
7.5.6.1.1
Reading Total Current
7.5.6.1.2
51
7.5.7
Output Voltage Margin Testing
7.5.7.1
(01h) OPERATION
7.5.7.2
(26h) VOUT_MARGIN_LOW
7.5.7.3
(25h) VOUT_MARGIN_HIGH
7.5.8
Loop Compensation
7.5.8.1
(D7h) MFR_SPECIFIC_07
7.5.8.2
(28h) VOUT_DROOP
7.5.9
Converter Protection and Response
7.5.10
Output Overvoltage Protection and Response
7.5.10.1
(40h) VOUT_OV_FAULT_LIMIT
7.5.10.2
(41h) VOUT_OV_FAULT_RESPONSE
7.5.11
Maximum Allowed Output Voltage Setting
7.5.11.1
(24h) VOUT_MAX
7.5.12
Output Undervoltage Protection and Response
7.5.12.1
(44h) VOUT_UV_FAULT_LIMIT
7.5.12.2
(45h) VOUT_UV_FAULT_RESPONSE
7.5.13
Minimum Allowed Output Voltage Setting
7.5.13.1
(2Bh) VOUT_MIN
7.5.14
Output Overcurrent Protection and Response
7.5.14.1
(46h) IOUT_OC_FAULT_LIMIT
7.5.14.2
(4Ah) IOUT_OC_WARN_LIMIT
7.5.14.3
(47h) IOUT_OC_FAULT_RESPONSE
7.5.14.4
Per Phase Overcurrent Limit Thresholds
7.5.15
Input Under-Voltage Lockout (UVLO)
7.5.15.1
(35h) VIN_ON
7.5.16
Input Over-Voltage Protection and Response
7.5.16.1
(55h) VIN_OV_FAULT_LIMIT
7.5.16.2
(56h) VIN_OV_FAULT_RESPONSE
7.5.17
Input Undervoltage Protection and Response
7.5.17.1
(59h) VIN_UV_FAULT_LIMIT
7.5.17.2
(5Ah) VIN_UV_FAULT_RESPONSE
7.5.18
Input Overcurrent Protection and Response
7.5.18.1
(5Bh) IIN_OC_FAULT_LIMIT
7.5.18.2
(5Dh) IIN_OC_WARN_LIMIT
7.5.18.3
(5Ch) IIN_OC_FAULT_RESPONSE
7.5.19
Overtemperature Protection and Response
7.5.19.1
(4Fh) OT_FAULT_LIMIT
7.5.19.2
(51h) OT_WARN_LIMIT
7.5.19.3
(50h) OT_FAULT_RESPONSE
7.5.20
Dynamic Phase Shedding (DPS)
7.5.20.1
(DEh) MFR_SPECIFIC_14
7.5.20.2
(DFh) MFR_SPECIFIC_15
7.5.21
NVM Programming
7.5.22
NVM Security
7.5.22.1
(FAh) MFR_SPECIFIC_42
7.5.23
Black Box Recording
7.5.23.1
(D8h) MFR_SPECIFIC_08
7.5.24
Board Identification and Inventory Tracking
7.5.25
Status Reporting
7.5.25.1
(78h) STATUS_BYTE
7.5.25.2
(79h) STATUS_WORD
7.5.25.3
(7Ah) STATUS_VOUT
7.5.25.4
(7Bh) STATUS_IOUT
7.5.25.5
(7Ch) STATUS_INPUT
7.5.25.6
(7Dh) STATUS_TEMPERATURE
7.5.25.7
(7Eh) STATUS_CML
7.5.25.8
(80h) STATUS_MFR_SPECIFIC
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Input Capacitors
8.2.2.2
Output Capacitors
8.2.2.3
Switching Frequency
8.2.2.4
Set PMBus Address
8.2.2.5
PMBus GUI Default Values
8.2.3
Application Performance Plots
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Examples
11
Device and Documentation Support
11.1
接收文档更新通知
11.2
支持资源
11.3
Trademarks
11.4
静电放电警告
11.5
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
MOA|28
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsio9a_oa
11.4
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。米6体育平台手机版_好二三四 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。
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