ZHCSIO9A August   2018  – June 2021 TPSM831D31

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  References: DAC
    7. 6.7  Telemetry
    8. 6.8  Current Sense and Calibration
    9. 6.9  Logic Interface Pins: A_EN, A_PGOOD, B_EN, B_PGOOD,RESET
    10. 6.10 Protections: OVP and UVP
    11. 6.11 Typical Characteristics (VIN = 12 V)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 DCAP+ Control
      2. 7.3.2 Setting the Load-Line (DROOP)
      3. 7.3.3 Start-Up Timing
      4. 7.3.4 Load Transitions
      5. 7.3.5 Switching Frequency
      6. 7.3.6 RESET Function
      7. 7.3.7 VID Table
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conduction Mode
      2. 7.4.2 Operation With EN Signal Control
      3. 7.4.3 Operation With OPERATION Control
      4. 7.4.4 Operation With EN and OPERATION Control
    5. 7.5 Programming
      1. 7.5.1  PMBus Connections
      2. 7.5.2  PMBus Address Selection
      3. 7.5.3  Supported Commands
      4. 7.5.4  Commonly Used PMBus Commands
      5. 7.5.5  Voltage, Current, Power, and Temperature Readings
        1. 7.5.5.1 (88h) READ_VIN
        2. 7.5.5.2 (89h) READ_IIN
        3. 7.5.5.3 (8Bh) READ_VOUT
        4. 7.5.5.4 (8Ch) READ_IOUT
        5. 7.5.5.5 (8Dh) READ_TEMPERATURE_1
        6. 7.5.5.6 (96h) READ_POUT
        7. 7.5.5.7 (97h) READ_PIN
        8. 7.5.5.8 (D4h) MFR_SPECIFIC_04
      6. 7.5.6  Output Current Sense and Calibration
        1. 7.5.6.1 Reading Individual Phase Currents
          1. 7.5.6.1.1 Reading Total Current
          2. 7.5.6.1.2 51
      7. 7.5.7  Output Voltage Margin Testing
        1. 7.5.7.1 (01h) OPERATION
        2. 7.5.7.2 (26h) VOUT_MARGIN_LOW
        3. 7.5.7.3 (25h) VOUT_MARGIN_HIGH
      8. 7.5.8  Loop Compensation
        1. 7.5.8.1 (D7h) MFR_SPECIFIC_07
        2. 7.5.8.2 (28h) VOUT_DROOP
      9. 7.5.9  Converter Protection and Response
      10. 7.5.10 Output Overvoltage Protection and Response
        1. 7.5.10.1 (40h) VOUT_OV_FAULT_LIMIT
        2. 7.5.10.2 (41h) VOUT_OV_FAULT_RESPONSE
      11. 7.5.11 Maximum Allowed Output Voltage Setting
        1. 7.5.11.1 (24h) VOUT_MAX
      12. 7.5.12 Output Undervoltage Protection and Response
        1. 7.5.12.1 (44h) VOUT_UV_FAULT_LIMIT
        2. 7.5.12.2 (45h) VOUT_UV_FAULT_RESPONSE
      13. 7.5.13 Minimum Allowed Output Voltage Setting
        1. 7.5.13.1 (2Bh) VOUT_MIN
      14. 7.5.14 Output Overcurrent Protection and Response
        1. 7.5.14.1 (46h) IOUT_OC_FAULT_LIMIT
        2. 7.5.14.2 (4Ah) IOUT_OC_WARN_LIMIT
        3. 7.5.14.3 (47h) IOUT_OC_FAULT_RESPONSE
        4. 7.5.14.4 Per Phase Overcurrent Limit Thresholds
      15. 7.5.15 Input Under-Voltage Lockout (UVLO)
        1. 7.5.15.1 (35h) VIN_ON
      16. 7.5.16 Input Over-Voltage Protection and Response
        1. 7.5.16.1 (55h) VIN_OV_FAULT_LIMIT
        2. 7.5.16.2 (56h) VIN_OV_FAULT_RESPONSE
      17. 7.5.17 Input Undervoltage Protection and Response
        1. 7.5.17.1 (59h) VIN_UV_FAULT_LIMIT
        2. 7.5.17.2 (5Ah) VIN_UV_FAULT_RESPONSE
      18. 7.5.18 Input Overcurrent Protection and Response
        1. 7.5.18.1 (5Bh) IIN_OC_FAULT_LIMIT
        2. 7.5.18.2 (5Dh) IIN_OC_WARN_LIMIT
        3. 7.5.18.3 (5Ch) IIN_OC_FAULT_RESPONSE
      19. 7.5.19 Overtemperature Protection and Response
        1. 7.5.19.1 (4Fh) OT_FAULT_LIMIT
        2. 7.5.19.2 (51h) OT_WARN_LIMIT
        3. 7.5.19.3 (50h) OT_FAULT_RESPONSE
      20. 7.5.20 Dynamic Phase Shedding (DPS)
        1. 7.5.20.1 (DEh) MFR_SPECIFIC_14
        2. 7.5.20.2 (DFh) MFR_SPECIFIC_15
      21. 7.5.21 NVM Programming
      22. 7.5.22 NVM Security
        1. 7.5.22.1 (FAh) MFR_SPECIFIC_42
      23. 7.5.23 Black Box Recording
        1. 7.5.23.1 (D8h) MFR_SPECIFIC_08
      24. 7.5.24 Board Identification and Inventory Tracking
      25. 7.5.25 Status Reporting
        1. 7.5.25.1 (78h) STATUS_BYTE
        2. 7.5.25.2 (79h) STATUS_WORD
        3. 7.5.25.3 (7Ah) STATUS_VOUT
        4. 7.5.25.4 (7Bh) STATUS_IOUT
        5. 7.5.25.5 (7Ch) STATUS_INPUT
        6. 7.5.25.6 (7Dh) STATUS_TEMPERATURE
        7. 7.5.25.7 (7Eh) STATUS_CML
        8. 7.5.25.8 (80h) STATUS_MFR_SPECIFIC
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Capacitors
        2. 8.2.2.2 Output Capacitors
        3. 8.2.2.3 Switching Frequency
        4. 8.2.2.4 Set PMBus Address
        5. 8.2.2.5 PMBus GUI Default Values
      3. 8.2.3 Application Performance Plots
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 Trademarks
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
  • MOA|28
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.2.2.1 Input Capacitors

For optimal performance, TI recommends 500 μF of ceramic capactiance and approximately 1000 μF of high-quality, polymer-aluminum bulk capacitance. Because the device requires ceramic capacitors to provide high-frequency noise filtering and ripple reduction, place them directly at the VIN pins of the device. The polymer-aluminum bulk capacitors supply current during load transients and provide a stable input voltage rail.

This application uses 528 µF (24 × 22 µF, 25 V, 1210 case size) of ceramic capacitance, as well as 940 µF (2 × 470 µF, 25 V) of polymer-aluminum capacitance. The ceramic capacitors are placed near each VIN pin and its coresponding GND pin.
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