ZHCSHN7B February   2018  – April 2018 TPSM84624

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
    1.     简化原理图
  3. 3 说明
    1.     瞬态响应
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics (VIN = 12 V)
    8. 6.8 Typical Characteristics (VIN = 5 V)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage
      2. 7.3.2  Switching Frequency (RT)
      3. 7.3.3  Synchronization (CLK)
      4. 7.3.4  Output On/Off Enable (EN)
      5. 7.3.5  Input Capacitor Selection
      6. 7.3.6  Output Capacitor Selection
      7. 7.3.7  TurboTrans (TT)
        1. 7.3.7.1 Low-ESR Output Capacitors
        2. 7.3.7.2 Transient Response
          1. 7.3.7.2.1 Transient Waveforms (VIN = 12 V)
      8. 7.3.8  Undervoltage Lockout (UVLO)
      9. 7.3.9  Soft Start (SS/TR)
      10. 7.3.10 Sequencing (SS/TR)
      11. 7.3.11 Power Good (PGOOD)
      12. 7.3.12 Safe Start-Up Into Pre-Biased Outputs
      13. 7.3.13 Overcurrent Protection
      14. 7.3.14 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Setpoint
        3. 8.2.2.3 Setting the Switching Frequency
        4. 8.2.2.4 Input Capacitors
        5. 8.2.2.5 Output Capacitors
        6. 8.2.2.6 TurboTrans Resistor
        7. 8.2.2.7 Application Waveforms
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 EMI
      1. 10.3.1 EMI Plots
    4. 10.4 Package Specifications
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 使用 WEBENCH® 工具创建定制设计
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.5 Electrical Characteristics

Over –40°C to +105°C ambient temperature, VIN = 12 V, VOUT = 1.2 V, IOUT = IOUTmax, fsw = 450 kHz (unless otherwise noted); CIN1 = 2× 10-µF, 25-V, 1210 ceramic; CIN2 = 100-µF, 50-V, electrolytic; COUT = 4× 47-µF, 10-V, 1210 ceramic. Minimum and maximum limits are specified through production test or by design. Typical values represent the most likely parametric norm and are provided for reference only.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INPUT VOLTAGE (VIN)
VIN Input voltage Over IOUT range 4.5(1) 17 V
UVLO VIN undervoltage lockout VIN increasing 4.1 4.3 V
VIN decreasing 3.7 3.9 V
ISHDN Shutdown supply current VEN = 0 V 3 11 µA
OUTPUT VOLTAGE (VOUT)
VOUT(ADJ) Output voltage adjust Over IOUT range 0.6 10 V
VOUT(Ripple) Output voltage ripple 20-MHz bandwidth 16 mV
FEEDBACK
VFB Feedback voltage(2) TA = 25°C, IOUT = 0 A 0.596 0.6 0.604 V
–40°C ≤ TJ ≤ 125°C, IOUT = 0 A 0.595 0.6 0.605 V
Line regulation Over VIN range, TA = 25°C, IOUT = 0 A 0.1 mV
Load regulation Over IOUT range, TA = 25°C 0.8 mV
CURRENT
IOUT Output current Natural convection, TA = 25°C 0 6 A
Overcurrent threshold 11 A
PERFORMANCE
ƞ Efficiency VIN = 12 V,
IOUT = 4 A		 VOUT = 5 V, fSW = 1.2 MHz 94%
VOUT = 3.3 V, fSW = 1.0 MHz 93%
VOUT = 1.8 V, fSW = 600 kHz 91%
VOUT = 1.2 V, fSW = 450 kHz 87%
VOUT = 1 V, fSW = 400 kHz 86%
Transient response
voltage deviation		 25% to 75% load step, 2A/µs slew rate,
RTT = 4.02 kΩ,
COUT = 200-µF ceramic + 220-µF polymer		 41 mV
25% to 75% load step, 2A/µs slew rate,
RTT = 8.87 kΩ, COUT = 400-µF ceramic		 33 mV
SOFT START
tSS Internal soft start time 1.25 ms
ISS Soft start charge current 5 µA
THERMAL
TSHDN Thermal shutdown Shutdown temperature 170 °C
Hysteresis 15 °C
ENABLE (EN)
VEN-H EN rising threshold 1.2 1.26 V
VEN-HYS EN falling threshold 1.1 1.15 V
IEN EN pin sourcing current VEN = 1.1 V 1.2 µA
VEN = 1.3 V 3.6 µA
POWER GOOD (PGOOD)
VPGOOD PGOOD thresholds VOUT rising (fault) 108%
VOUT falling (good) 106%
VOUT rising (good) 91%
VOUT falling (fault) 89%
Minimum VIN for valid PGOOD VPGOOD< 0.5 V, IPGOOD = 2 mA 0.7 1 V
PGOOD low voltage 2-mA pullup, VEN = 0 V 0.3 V
CAPACITANCE
CIN External input capacitance Ceramic type 20(3) µF
Non-ceramic type 100(3) µF
COUT External output capacitance min(4) 1500(5) µF
(1) For output voltages 0.6 V to < 5.5 V, the recommended minimum VIN is 4.5 V or (VOUT + 1 V), whichever is greater. For output voltages 5.5 V to < 9 V, the recommended minimum VIN is (VOUT + 2 V). For output voltages 9 V to 10 V, the recommended minimum VIN is (VOUT + 3 V).
(2) The overall output voltage tolerance will be affected by the tolerance of the external RFBT and RFBB resistors.
(3) A minimum of 20-µF ceramic input capacitance is required for proper operation. An additional 100 µF of bulk capacitance is recommended for applications with transient load requirements. See the Input Capacitor section for further guidance.
(4) The minimum amount of required output capacitance varies depending on the output voltage (see Standard Component Values Table). A minimum amount of ceramic output capacitance is required. Locate the capacitance close to the device. Adding additional ceramic or non-ceramic capacitance close to the load improves the response of the regulator to load transients.
(5) The maximum output capacitance can be made up of all ceramic type or a combination of ceramic and a single non-ceramic type. See the Low-ESR Output Capacitors Section for requirements of non-ceramic output capacitors.
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