ZHCSG68F MARCH   2017  – JANUARY 2019 TPSM846C23

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化电路原理图
      2.      效率与输出电流间的关系
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Programmable Characteristics
    8. 6.8 Typical Characteristics (VIN = 12 V)
    9. 6.9 Typical Characteristics (VIN = 5 V)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  PMBus
        1. 7.3.1.1 PMBus General Description
        2. 7.3.1.2 PMBus Address
        3. 7.3.1.3 PMBus Connections
        4. 7.3.1.4 Supported PMBus Commands
      2. 7.3.2  Minimum Capacitance Requirements
      3. 7.3.3  Setting the Compensation Network
      4. 7.3.4  Transient Response
      5. 7.3.5  Setting the Output Voltage via PMBus
      6. 7.3.6  Setting the Output Voltage Without PMBus
      7. 7.3.7  Differential Remote Sense
      8. 7.3.8  Voltage Reference
      9. 7.3.9  Switching Frequency and Synchronization
        1. 7.3.9.1 Setting the Switching Frequency
        2. 7.3.9.2 Synchronization
          1. 7.3.9.2.1 Stand-Alone Device
          2. 7.3.9.2.2 Paralleled Devices
      10. 7.3.10 Input Undervoltage Lockout (UVLO)
      11. 7.3.11 Turnon and Turnoff Delay and Sequencing
      12. 7.3.12 Soft-Start Time and TON_RISE Command
      13. 7.3.13 Soft-Stop Time and TOFF_FALL Command
      14. 7.3.14 Prebiased Output Start-Up
      15. 7.3.15 Power Good (PGOOD) Indicator
      16. 7.3.16 Linear Regulators BP3 and BP6
      17. 7.3.17 VREF_TRIM
      18. 7.3.18 MARGIN
      19. 7.3.19 Parallel Application
      20. 7.3.20 Parallel Operation
      21. 7.3.21 Telemetry
        1. 7.3.21.1 Output Current Telemetry
        2. 7.3.21.2 Output Voltage Telemetry
        3. 7.3.21.3 Junction Temperature Telemetry
      22. 7.3.22 Overtemperature Protection
      23. 7.3.23 Overcurrent Protection
      24. 7.3.24 Output Overvoltage and Undervoltage Protection
      25. 7.3.25 Fault Protection Responses
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conduction Mode
      2. 7.4.2 Operation With CNTL Signal Control
      3. 7.4.3 Operation With OPERATION Control
      4. 7.4.4 Operation With CNTL and OPERATION Control
    5. 7.5 Register Maps
      1. 7.5.1  OPERATION (01h)
        1. 7.5.1.1 On Bit
        2. 7.5.1.2 Off Bit
        3. 7.5.1.3 Margin Bit
      2. 7.5.2  ON_OFF_CONFIG (02h)
        1. 7.5.2.1 pu Bit
        2. 7.5.2.2 cmd Bit
        3. 7.5.2.3 cpr Bit
        4. 7.5.2.4 pol Bit
        5. 7.5.2.5 cpa Bit
      3. 7.5.3  CLEAR_FAULTS (03h)
      4. 7.5.4  WRITE_PROTECT (10h)
        1. 7.5.4.1 bit5
        2. 7.5.4.2 bit6
        3. 7.5.4.3 bit7
      5. 7.5.5  STORE_DEFAULT_ALL (11h)
      6. 7.5.6  RESTORE_DEFAULT_ALL (12h)
      7. 7.5.7  STORE_USER_ALL (15h)
      8. 7.5.8  RESTORE_USER_ALL (16h)
      9. 7.5.9  CAPABILITY (19h)
      10. 7.5.10 SMBALERT_MASK (1Bh)
      11. 7.5.11 VOUT_MODE (20h)
        1. 7.5.11.1 Mode Bit
        2. 7.5.11.2 Exponent Bit
      12. 7.5.12 VOUT_COMMAND (21h)
        1. 7.5.12.1 Exponent
        2. 7.5.12.2 Mantissa
      13. 7.5.13 VOUT_MAX (24h)
        1. 7.5.13.1 Exponent
        2. 7.5.13.2 Mantissa
      14. 7.5.14 VOUT_TRANSITION_RATE (27h)
        1. 7.5.14.1 Exponent
        2. 7.5.14.2 Mantissa
      15. 7.5.15 VOUT_SCALE_LOOP (29h)
        1. 7.5.15.1 Exponent
        2. 7.5.15.2 Mantissa
      16. 7.5.16 VOUT_MIN (2Bh)
        1. 7.5.16.1 Exponent
        2. 7.5.16.2 Mantissa
      17. 7.5.17 VIN_ON (35h)
        1. 7.5.17.1 Exponent
        2. 7.5.17.2 Mantissa
      18. 7.5.18 VIN_OFF (36h)
        1. 7.5.18.1 Exponent
        2. 7.5.18.2 Mantissa
      19. 7.5.19 IOUT_CAL_OFFSET (39h)
        1. 7.5.19.1 Exponent
        2. 7.5.19.2 Mantissa
      20. 7.5.20 VOUT_OV_FAULT_RESPONSE (41h)
        1. 7.5.20.1 RSP[1] Bit
        2. 7.5.20.2 RS[2:0] Bits
        3. 7.5.20.3 TD[2:0] Bits
      21. 7.5.21 VOUT_UV_FAULT_RESPONSE (45h)
        1. 7.5.21.1 RSP[1] Bit
        2. 7.5.21.2 RS[2:0] Bits
        3. 7.5.21.3 TD[2:0] Bits
      22. 7.5.22 IOUT_OC_FAULT_LIMIT (46h)
        1. 7.5.22.1 Exponent
        2. 7.5.22.2 Mantissa
      23. 7.5.23 IOUT_OC_FAULT_RESPONSE (47h)
        1. 7.5.23.1 RSP[1:0] Bits
        2. 7.5.23.2 RS[2:0] Bits
        3. 7.5.23.3 TD[2:0] Bits
      24. 7.5.24 IOUT_OC_WARN_LIMIT (4Ah)
        1. 7.5.24.1 Exponent
        2. 7.5.24.2 Mantissa
      25. 7.5.25 OT_FAULT_LIMIT (4Fh)
        1. 7.5.25.1 Exponent
        2. 7.5.25.2 Mantissa
      26. 7.5.26 OT_FAULT_RESPONSE (50h)
        1. 7.5.26.1 RSP[1] Bit
        2. 7.5.26.2 RS[2:0] Bits
        3. 7.5.26.3 TD[2:0] Bits
      27. 7.5.27 OT_WARN_LIMIT (51h)
        1. 7.5.27.1 Exponent
        2. 7.5.27.2 Mantissa
      28. 7.5.28 TON_DELAY (60h)
        1. 7.5.28.1 Exponent
        2. 7.5.28.2 Mantissa
      29. 7.5.29 TON_RISE (61h)
        1. 7.5.29.1 Exponent
        2. 7.5.29.2 Mantissa
      30. 7.5.30 TON_MAX_FAULT_LIMIT (62h)
        1. 7.5.30.1 Exponent
        2. 7.5.30.2 Mantissa
      31. 7.5.31 TON_MAX_FAULT_RESPONSE (63h)
        1. 7.5.31.1 RSP[1] Bit
        2. 7.5.31.2 RS[2:0] Bits
        3. 7.5.31.3 TD[2:0] Bits
      32. 7.5.32 TOFF_DELAY (64h)
        1. 7.5.32.1 Exponent
        2. 7.5.32.2 Mantissa
      33. 7.5.33 TOFF_FALL (65h)
        1. 7.5.33.1 Exponent
        2. 7.5.33.2 Mantissa
      34. 7.5.34 STATUS_BYTE (78h)
      35. 7.5.35 STATUS_WORD (79h)
      36. 7.5.36 STATUS_VOUT (7Ah)
      37. 7.5.37 STATUS_IOUT (7Bh)
      38. 7.5.38 STATUS_INPUT (7Ch)
      39. 7.5.39 STATUS_TEMPERATURE (7Dh)
      40. 7.5.40 STATUS_CML (7Eh)
      41. 7.5.41 STATUS_MFR_SPECIFIC (80h)
      42. 7.5.42 READ_VOUT (8Bh)
        1. 7.5.42.1 Exponent
        2. 7.5.42.2 Mantissa
      43. 7.5.43 READ_IOUT (8Ch)
        1. 7.5.43.1 Exponent
        2. 7.5.43.2 Mantissa
      44. 7.5.44 READ_TEMPERATURE_1 (8Dh)
        1. 7.5.44.1 Exponent
        2. 7.5.44.2 Mantissa
      45. 7.5.45 PMBUS_REVISION (98h)
      46. 7.5.46 IC_DEVICE_ID (ADh)
      47. 7.5.47 IC_DEVICE_REV (AEh)
      48. 7.5.48 MFR_SPECIFIC_00 (D0h)
      49. 7.5.49 VREF_TRIM (MFR_SPECIFIC_04) (D4h)
      50. 7.5.50 STEP_VREF_MARGIN_HIGH (MFR_SPECIFIC_05) (D5h)
      51. 7.5.51 STEP_VREF_MARGIN_LOW (MFR_SPECIFIC_06) (D6h)
      52. 7.5.52 PCT_OV_UV_WRN_FLT_LIMITS (MFR_SPECIFIC_07) (D7h)
      53. 7.5.53 OPTIONS (MFR_SPECIFIC_21) (E5h)
        1. 7.5.53.1  DIS_NEGILIM Bit
        2. 7.5.53.2  EN_RESET_B Bit
        3. 7.5.53.3  EN_ADC_CNTL Bit
        4. 7.5.53.4  VSM Bit
        5. 7.5.53.5  DLO Bit
        6. 7.5.53.6  AVG_PROG[1:0] Bits
        7. 7.5.53.7  EN_AUTO_ARA Bit
        8. 7.5.53.8  READ_VOUT_RANGE[1:0] Bits
        9. 7.5.53.9  RST_VOUT_oSD Bit
        10. 7.5.53.10 RSMLO_VAL Bit
        11. 7.5.53.11 RSMHI_VAL Bit
      54. 7.5.54 MISC_CONFIG_OPTIONS (MFR_SPECIFIC_32) (F0h)
        1. 7.5.54.1 OV_RESP_SEL Bit
        2. 7.5.54.2 HSOC_USER_TRIM[1:0] Bits
        3. 7.5.54.3 EN_AVS_USER Bit
        4. 7.5.54.4 FORCE_SYNC_OUT Bit
        5. 7.5.54.5 FORCE_SYNC_IN Bit
        6. 7.5.54.6 SYNC_FAULT_DIS Bit
  8. 8 Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Design Requirements
      2. 8.1.2 Detailed Design Procedure
        1. 8.1.2.1 Custom Design With WEBENCH® Tools
        2. 8.1.2.2 Setting the Output Voltage
        3. 8.1.2.3 Input and Output Capacitance
        4. 8.1.2.4 Selecting the Compensation Components
        5. 8.1.2.5 Setting the Switching Frequency
        6. 8.1.2.6 Power Good (PGOOD)
        7. 8.1.2.7 ON/OFF Control (CNTL)
      3. 8.1.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Package Specifications
    4. 10.4 EMI
    5. 10.5 Mounting and Thermal Profile Recommendation
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 使用 WEBENCH® 工具创建定制设计
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息
    1. 12.1 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

MOL Package
59-Pin BQFN
Top View
TPSM846C23 SegerPinout5.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
ADDR0 17 I Connect a resistor from this pin to AGND to set the low-order 3 bits of the desired PMBus address. Do not leave this pin floating. See PMBus Address.
ADDR1 16 I Connect a resistor from this pin to AGND to set the high-order 3 bits of the desired PMBus address. Do not leave this pin floating. See PMBus Address.
AGND 10 G Analog ground for the controller circuitry. This pin is internally connected to PGND.
ALERT 20 O PMBus ALERT pin. See PMBus specification.
BP_RTN 51 G Return path for VINBP and BP3. This pin is internally connected to PGND, pad 59.
BP3 47 O Output of the internal 3.3-V regulator. Bypass this pin with a minimum of 2.2-µF to BP_RTN. Can be used as a pullup termination voltage for PGOOD and PMBus signals.
BP6 49 O Output of the internal 6.5-V regulator that powers the driver stage of the device. Bypass this pin with a minimum of 2.2-µF to BP6_RTN.
BP6_RTN 48 G Power ground return path for BP6 bypass capacitor.
CLK 19 I PMBus CLK pin. See PMBus specification.
CNTL 12 I PMBus CNTL pin. See PMBus specification.
COMP 9 O Output of the error amplifier.
DATA 18 I/O PMBus DATA pin. See PMBus specification.
DIFFO 6 O Output of the remote sense differential amplifier. This provides remote sensing for output voltage reporting and the voltage control loop.
DNC 8, 21, 30, 31 – Do Not Connect. Do not connect these pins to AGND, PGND, to another DNC pin, or to any other voltage. These pins are connected to internal circuitry. Each pin must be soldered to an isolated pad.
FB 7 I Feedback pin for the control loop.
ISHARE 2 I Current sharing signal for parallel operation.
NC 1, 15 – Not Connected. These pins are internally isolated from any signal and all other pins. Each pin must be soldered to a pad on the PCB. These pins can be left isolated or connected to AGND or PGND.
PGND 32, 33, 34, 35,
36,42, 43, 54,
56, 57, 58, 59		 G Power ground of the device. This is the return current path for the power stage of the device. Connect these pins to the bypass capacitors associated with VIN and VOUT. Connect pads 56, 57, 58, and 59 to the PCB ground planes using multiple vias for optimal thermal performance. All pins should be connected together externally with a copper plane or pour directly under the device.
PGOOD 52 O Power good indicator. This pin is an open-drain output and will assert low during any fault/warn conditions. See Power Good Indicator section for details. Requires a pullup resistor.
PH 22, 23, 24,
25, 26, 27,
28, 29		 O Phase switch node. Do not connect any external components to these pins or tie them to a pin of another function.
RT 13 I Frequency-setting resistor. To operate the device at its default switching frequency, do not connect to this pin. To operate at a different switching frequency, connect a resistor from this pin to AGND.
RT_SEL 14 I RT resistor select. To operate the device at its default switching frequency, connect this pin to AGND. To operate at a different switching frequency, let this pin float.
SYNC 11 I/O Frequency synchronization pin. In a stand-alone application or as the Master device in a parallel configuration, the SYNC pin is configured as a SYNC-IN pin and power conversion is synchronized to the rising edge of a 50% duty cycle external clock applied to this pin.

For a Slave device in a parallel configuration, power conversion is synchronized to the falling edge of the incoming clock.
VIN 44, 45,
46, 53		 I Input switching voltage pins. These pins supply voltage to the power switches of the converter.
VINBP 50 I Input power to the controller circuitry. Bypass this pin with a minimum of 1 µF to BP_RTN. This pin is internally connected to VIN.
VOUT 37, 38, 39,
40, 41, 55		 O Output voltage. These pins are connected to the internal output inductor. Connect these pins to the output load and connect external bypass capacitors between these pins and PGND.
VS+ 4 I Positive input of the remote amplifier. Connect this pin to VOUT at the load for best voltage regulation. Do not let this pin float.
VS– 5 I Negative input of the remote amplifier. Connect this pin to ground at the load for best voltage regulation. Do not let this pin float.
VSHARE 3 I/O Voltage sharing signal for parallel operation.
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