ZHCSOO7A
August 2021 – November 2021
TPSM8A28
,
TPSM8A29
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Internal VCC LDO and Using External Bias on VCC Pin
7.3.2
Enable
7.3.3
Output Voltage Setting
7.3.3.1
Remote Sense
7.3.4
Internal Fixed Soft Start and External Adjustable Soft Start
7.3.5
External REFIN for Output Voltage Tracking
7.3.6
Frequency and Operation Mode Selection
7.3.7
D-CAP3™ Control
7.3.8
Low-Side FET Zero-Crossing
7.3.9
Current Sense and Positive Overcurrent Protection
7.3.10
Low-Side FET Negative Current Limit
7.3.11
Power Good
7.3.12
Overvoltage and Undervoltage Protection
7.3.13
Out-Of-Bounds (OOB) Operation
7.3.14
Output Voltage Discharge
7.3.15
UVLO Protection
7.3.16
Thermal Shutdown
7.4
Device Functional Modes
7.4.1
Auto-Skip Eco-Mode Light Load Operation
7.4.2
Forced Continuous-Conduction Mode
7.4.3
Powering the Device From a 12-V Bus
7.4.4
Powering the Device From a 5.0-V Bus
7.4.5
Powering the Device From a Split-Rail Configuration
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Output Voltage Setting Point
8.2.2.2
Choose the Inductor
8.2.2.3
Set the Current Limit (TRIP)
8.2.2.4
Choose the Output Capacitor
8.2.2.5
Choose the Input Capacitors (CIN)
8.2.2.6
Soft-Start Capacitor (SS/REFIN Pin)
8.2.2.7
EN Pin Resistor Divider
8.2.2.8
VCC Bypass Capacitor
8.2.2.9
BOOT Capacitor
8.2.2.10
PGOOD Pullup Resistor
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
10.2.1
Thermal Performance on the TI EVM
10.3
EMI
11
Device and Documentation Support
11.1
Device Support
11.1.1
第三方米6体育平台手机版_好二三四免责声明
11.2
Documentation Support
11.2.1
Related Documentation
11.3
接收文档更新通知
11.4
支持资源
11.5
Trademarks
11.6
Electrostatic Discharge Caution
11.7
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RDG|25
MPQF603
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsoo7a_oa
2
应用
数据中心交换机
核心路由器
单板计算机
光学模块
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