Layout is critical for good power-supply design.
Section 8.5.2 shows the recommended PCB-layout
configuration. A list of PCB layout considerations
using these devices is listed as follows:
As with any switching regulator, several power or
signal paths exist that conduct fast switching
voltages or currents. Minimize the loop area
formed by these paths and their bypass
connections.
Bypass the PVIN pins to PGND with a low-impedance
path. Place the input bypass capacitors of the
power-stage as close as physically possible to the
PVIN and PGND pins. A high-frequency bypass
capacitor is integrated to reduce switching spikes
and EMI. Additional EMI bypass capacitor can be
placed on the other side of the PCB directly
underneath the device to keep a minimum loop.
The AVIN bypass capacitor should be placed close
to the AVIN pin and provide a low-impedance path
to PGND at the thermal pad.
Keep signal components local
to the device, and place them as close as possible
to the pins to which they are connected. These
components include the VOSNS and GOSNS series
resistors and differential filter capacitor as
well as MSEL1, MSEL2, VSEL, and ADRSEL resistors.
Those components can be terminated to AGND with a
minimum return loop or bypassed to the copper area
of a separate low-impedance analog ground (AGND)
that is isolated from fast switching voltages and
current paths and has single connection to PGND on
the thermal pad through the AGND pin. For
placement recommendations, see
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