米6体育平台手机版

ZHCSMI2B november 2022 – august 2023 TRF0206-SP

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		TRF0206-SP	UNIT
		FFM (LCCC)
		12 PINS
R_θJA	Junction-to-ambient thermal resistance	69.3	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	54.5	°C/W
R_θJB	Junction-to-board thermal resistance	44.4	°C/W
Ψ_JT	Junction-to-top characterization parameter	42	°C/W
Ψ_JB	Junction-to-board characterization parameter	44.5	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	36.7	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.