ZHCSCH6 May   2014 TRF37A73

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Down
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply Input voltage –0.3 3.6 V
Input Power 10 dBm
Operating virtual junction temperature range –40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 Handling Ratings

MIN MAX UNIT
TSTG Storage temperature range –65 150 °C
VESD Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) –1 1 kV
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) –1 1 kV
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply Voltage, VCC 3 3.3 3.45 V
Operating junction temperature, TJ –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) DSG UNIT
8 PINS
RθJA Junction-to-ambient thermal resistance 79.3 °C/W
RθJCtop Junction-to-case (top) thermal resistance 110
RθJB Junction-to-board thermal resistance 49
ψJT Junction-to-top characterization parameter 6
ψJB Junction-to-board characterization parameter 49.4
RθJCbot Junction-to-case (bottom) thermal resistance 19.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

VCC = 3V3, TA = 25°C, PWDN = Low, LOUT = 100 nH, C1 = C2 = 1000 pF, ZS = ZL = 50 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DC PARAMETERS
ICC Total supply current 55 65 mA
Power down current PWDN = High 125 µA
Pdiss Power dissipation 0.182 W
RF FREQUENCY RANGE
Frequency range 1 6000 MHz
G Small signal gain fRF = 400 MHz 12.5 dB
fRF = 2000 MHz 12 dB
fRF = 3000 MHz 11.5 dB
fRF = 4000 MHz 11.5 dB
fRF = 5000 MHz 11 dB
fRF = 6000 MHz 10.5 dB
OP1dB Output 1dB compression point At 2000 MHz 14.5 dBm
OIP3 Output 3rd order intercept point At 2000 MHz, 2-tone 10 MHz apart 28.5 dBm
NF Noise figure At 2000 MHz 4.5 dB
R(LI) Input return loss At 2000 MHz 16 dB
R(LO) Output return loss At 2000 MHz 15 dB
PWDN PIN
VIH High level input level 2 V
VIL Low level input level 0.8 V
IIH High level input current 30 µA
IIL Low level input current 1 µA

6.6 Timing Requirements

MIN TYP MAX UNIT
PWDN PIN
tON Turn-on Time 50% TTL to 90% POUT 0.6 µs
tOFF Turn-off Time 50% TTL to 10% POUT 1.4 µs

6.7 Typical Characteristics

C001_SLASE39.png
VCC curves Temp = 25°C Pin = –10 dBm
Figure 1. Gain vs Frequency
C003_SLASE39.png
VCC curves Temp = 25°C
Figure 3. OP1dB vs Frequency
C005_SLASE39.png
VCC curves Temp = 25°C Pin = –10 dBm/tone
Figure 5. OIP3 vs Frequency
C007_SLASE39.png
VCC curves Temp = 25°C
Figure 7. NF vs Frequency
C009_SLASE39.png
VCC curves Temp = 25°C
Figure 9. ICC vs Frequency
smithchart_slase39.gif
VCC = 3.3 V Temp = 25°C 1 MHz to 8 GHz
Data Taken with EVM and Bias T, De-embedded to DUT pin
Figure 11. Smith Chart – S11, S22
C002_SLASE39.png
Temp curves VCC = 3.3 V Pin = –10 dBm
Figure 2. Gain vs Frequency
C004_SLASE39.png
Temp curves VCC = 3.3 V
Figure 4. OP1dB vs Frequency
C006_SLASE39.png
Temp curves VCC = 3.3 V Pin = –10 dBm/tone
Figure 6. OIP3 vs Frequency
C008_SLASE39.png
Temp curves VCC = 3.3 V
Figure 8. NF vs Frequency
C010_SLASE39.png
Temp curves VCC = 3.3 V
Figure 10. ICC vs Frequency
C016.png
VCC = 3.3 V Temp = 25°C 1 MHz to 8 GHz
Data Taken with EVM and Bias T, De-embedded to DUT pin
Figure 12. S22, S11, S12, S21
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