ZHCSMX2B June 2007 – July 2021 TRS3221E
PRODUCTION DATA
- 1 特性
- 2 应用
- 3 说明
- 4 Revision History
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 ESD Ratings, IEC Specifications
- 6.4 Recommended Operating Conditions
- 6.5 Thermal Information
- 6.6 Electrical Characteristics
- 6.7 Driver Section Electrical Characteristics
- 6.8 Driver Section Switching Characteristics
- 6.9 Receiver Section Electrical Characteristics
- 6.10 Receiver Section Switching Characteristics
- 6.11 Auto-Powerdown Section Electrical Characteristics
- 6.12 Auto-Powerdown Section Switching Characteristics
- 6.13 Typical Characteristics
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application Information Disclaimer
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
- RGT|16
订购信息
6.13 Typical Characteristics
VCC = 3.3 V and TA = 25 °C unless specified otherwise.
Figure 6-1 Driver Pulse Skew vs Load Capacitance and Supply Voltage at TA =
25 °C (RGT Package)
Figure 6-3 Receiver Path High-to-Low
Propagation Delay vs TA and Supply Voltage (RGT Package). 
Figure 6-2 Receiver Path Low-to-High Propagation Delay vs TA and Supply
Voltage (RGT Package)
Figure 6-4 Receiver Pulse Skew
(|tpLH - tpHL|) vs TA and Supply
Voltage (RGT Package).