ZHCSON3A June   2007  – August 2021 TRS3222E

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings - IEC Specifications
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Electrical Characteristics: Driver
    8. 6.8  Switching Characteristics: Driver
    9. 6.9  Electrical Characteristics: Receiver
    10. 6.10 Switching Characteristics: Receiver
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
  10. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

ESD Ratings

VALUEUNIT
V (ESD)Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

All pins except RIN1, RIN2, DOUT1 and DOUT2 pins

±3000V

RIN1, RIN2, DOUT1 and DOUT2 pins to GND

±15000
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

All pins

±1500
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.