米6体育平台手机版

ZHCSON3A June 2007 – August 2021 TRS3222E

PRODUCTION DATA

6.5 Thermal Information

THERMAL METRIC⁽¹⁾		TRS3222E			UNIT
		DB (SSOP)	DW (SOIC)	PW (TSSOP)
		20 Pins	20 Pins	20 Pins
R _θJA	Junction-to-ambient thermal resistance	70	58	94.1	°C/W
R _θJC(top)	Junction-to-case (top) thermal resistance	33.6	30.0	35.2	°C/W
R_θJB	Junction-to-board thermal resistance	36.4	29.6	45.5	°C/W
ψ _JT	Junction-to-top characterization parameter	4.8	7.7	3.1	°C/W
ψ _JB	Junction-to-board characterization parameter	35.9	29.3	45.1	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.