10 Revision History
Changes from Revision D (June 2021) to Revision E (December 2024)
- 将器件信息 表更改为封装信息 表Go
- 向数据表中添加了 SOT-23-THN (DYY) 封装Go
- Added Note 2 to the ESD ratings
- IEC Specifications
Go
Changes from Revision C (June 2021) to Revision D (June 2021)
- 添加了应用工业 PC、有线网络、数据中心和企业级计算Go
- Changed the table note in the ESD Ratings - IEC Specifications to make it
applicable to D, DB and PW packages. Go
- Changed the thermal parameter values for D, DB and PW packages in the Thermal Information tableGo
Changes from Revision B (October 2017) to Revision C (June 2021)
- 向器件信息 添加了 RGT 封装Go
- Added the RGT Pin Configuration
Go
- Added the ESD Ratings - IEC Specifications
Go
- Added RGT to the Thermal Information
Go
- Added RGT package to the Switching
Characteristics
Go
- Changed the capacitor value From: 1 µf To: 0.1 µf in the Layout
Diagram
Go
Changes from Revision A (July 2015) to Revision B (October 2017)
- 添加了特性：可与低至 2.7V VCC 的 RS-232 交互操作Go
- Added Figure 5-3
Go
Changes from Revision * (April 2007) to Revision A (July 2015)
- 删除了订购信息 表Go
- 添加了器件信息 表、引脚配置和功能 部分、ESD 等级 表、热性能信息 表、特性说明 部分、器件功能模式、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go