米6体育平台手机版

ZHCSR59E April 2007 – December 2022 TRS3243E

PRODUCTION DATA

6.5 Thermal Information

THERMAL METRIC⁽¹⁾		VQFN (RHB)	TSSOP (PW)	SOIC (DW)	DB (SSOP)	UNIT
THERMAL METRIC⁽¹⁾		32 PINS	28 PINS	28 PINS	28 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance	34.1	70.3	59.0	76.1	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	25.9	21.0	28.8	35.8	°C/W
R_θJB	Junction-to-board thermal resistance	14.6	29.2	30.3	37.4	°C/W
ψ_JT	Junction-to-top characterization parameter	0.5	1.3	7.8	7.4	°C/W
ψ_JB	Junction-to-board characterization parameter	14.6	28.8	30.0	37.0	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	5.1	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.