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ZHCSO02B July 2007 – July 2021 TRSF3221E

PRODUCTION DATA

6.5 Thermal Resistance Characteristics

THERMAL METRIC⁽¹⁾		TRSF3221E			UNIT
		DB (SSOP)	PW (TSSOP)	RGT (VQFN)
		16 Pins	16 Pins	16 Pins
R _θJA	Junction-to-ambient thermal resistance	82	110.9	58.8	°C/W
R _θJC(top)	Junction-to-case (top) thermal resistance	45.7	41.7	55.8	°C/W
R _θJB	Junction-to-board thermal resistance	44.4	57.2	23.8	°C/W
ψ _JT	Junction-to-top characterization parameter	11.0	4.2	1.7	°C/W
ψ _JB	Junction-to-board characterization parameter	43.8	56.6	23.7	°C/W
R _θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	9	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.